The pad is 0.3mm/center distance is 0.5mm and the wire cannot come out

yangxf1217

The pad is 0.3mm/center distance is 0.5mm and the wire cannot come out [Copy link]

In this case, I wonder how you guys route the wires? I used padless vias with inner and outer diameters of 0.3mm, and routed them from the bottom layer. Now I have a problem, some power vias cannot be connected to the middle power layer, I wonder where the settings are incorrect? Please advise. I used AD14

yangxf1217

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yangxf1217

OK, the software has a bug. I set it to connect the inner electrical layer and the via directly, and then switched back to the plum blossom connection.

qwqwqw2088

Check whether the network name of the via attribute is consistent with the middle power layer. Generally, they are connected, unless the middle layer solder ring is set to 0, indicating that the via has no pad.

qwqwqw2088

AD14 seems to be less used and has more bugs than AD15. AD13 is more stable

yangxf1217

qwqwqw2088 Published on 2019-4-15 11:55 AD14 seems to be less used and has more bugs than AD15. AD13 is more stable

ad14 is indeed, I encountered many bugs. Has the moderator done a similar design? How big a hole is suitable for such a small spacing? In addition, it seems that it is inevitable to have a hole in the plate, which should affect the welding quality. How can we make the welding yield rate higher?