Huawei is suing multiple U.S. government agencies to force them to release documents that the company believes could reveal the political motivations behind the arrest of its chief financial officer, Meng Wanzhou, CBC News reported.
In a complaint filed last week in federal district court in Washington, D.C., Huawei accused the Trump administration of "obstructing" freedom of information requests to 16 agencies, including the FBI, the U.S. Justice Department and the Commerce Department.
Huawei's lawyers said there were indications the U.S. wanted to use criminal charges against the company and Meng to "advance policy objectives unrelated to the fair administration of criminal justice."
In addition to inter-agency documents, the lawsuit seeks communications between the Department of Homeland Security, the Department of Justice and "certain Canadian authorities involved in the investigation or arrest of Ms. Meng."
“These communications are primarily intended to identify communications that may indicate that the basis for the prosecution of Huawei and Ms. Meng is improper,” the lawsuit reads.
The complaint goes on to list reasons Huawei claims Meng should be extradited, including to disrupt Huawei's "dominant position" in the 5G wireless market and to strengthen the U.S. position in trade negotiations with China.
Previous article:Bloomberg: iPhone 12 series faces power management chip shortage
Next article:STMicroelectronics' third quarter financial report shows "secret" layout of RF communications
Recommended ReadingLatest update time:2024-11-23 15:23
- Popular Resources
- Popular amplifiers
- iPhone SE 4 reportedly debuts with Apple's self-developed 5G baseband: coming in March next year
- iPhone 17 series revealed to be the first to use 3nm A19 series chips: no chance of TSMC's 2nm process
- The supply chain said that upstream components will be greatly reduced in price: Will domestic mobile phones take the initiative to reduce their prices after the current price increase?
- Apple to spend nearly $100 million to lift Indonesia's iPhone 16 sales ban
- Tata Motors acquires Pegatron's only iPhone factory in India, deepening cooperation with Apple
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- Intel promotes AI with multi-dimensional efforts in technology, application, and ecology
- ChinaJoy Qualcomm Snapdragon Theme Pavilion takes you to experience the new changes in digital entertainment in the 5G era
- Infineon's latest generation IGBT technology platform enables precise control of speed and position
- Two test methods for LED lighting life
- Don't Let Lightning Induced Surges Scare You
- Application of brushless motor controller ML4425/4426
- Easy identification of LED power supply quality
- World's first integrated photovoltaic solar system completed in Israel
- Sliding window mean filter for avr microcontroller AD conversion
- What does call mean in the detailed explanation of ABB robot programming instructions?
- STMicroelectronics discloses its 2027-2028 financial model and path to achieve its 2030 goals
- 2024 China Automotive Charging and Battery Swapping Ecosystem Conference held in Taiyuan
- State-owned enterprises team up to invest in solid-state battery giant
- The evolution of electronic and electrical architecture is accelerating
- The first! National Automotive Chip Quality Inspection Center established
- BYD releases self-developed automotive chip using 4nm process, with a running score of up to 1.15 million
- GEODNET launches GEO-PULSE, a car GPS navigation device
- Should Chinese car companies develop their own high-computing chips?
- Infineon and Siemens combine embedded automotive software platform with microcontrollers to provide the necessary functions for next-generation SDVs
- Continental launches invisible biometric sensor display to monitor passengers' vital signs
- I need help with the isolation problem between two 232 chips!
- Gallium Nitride
- EEWORLD University - Machine Learning from Zero to One
- EEWORLD University Hall----Live Replay: New Generation Multi-Band Protocol TI SimpleLink MCU Platform
- Goodbye 2019, hello 2020! Maker education has a long way to go
- Mir MYC-YT507 development board review: Development environment part 3: Qt tank game
- XMC4800 Review (Part 1)
- FPGA Development Guide - Timing Constraints
- Resistor Programmable Oscillator
- BYD e6 battery pack battery management system