Adaptive cable equalizers are an essential component of the receiver front end for serial digital video (SDV) broadcast and serial telecommunication equipment, and they can also be used in other types of wired communication systems. The equalizer interfaces directly with the transmission line, restoring the signal amplitude and bandwidth losses caused by the cable. Because the equalizer is directly connected to the cable, it is very susceptible to ESD, EMI/RFI, and device-generated noise, and the operating characteristics of the equalizer tend to increase the effects of noise in the design. A robust system using an interference-resistant adaptive cable equalizer must also maintain the good operating characteristics of the equalizer, such as wide input dynamic range, wide signal bandwidth, low residual output noise, high input return loss, and maximum equalized cable length.
ESD, EMI/RFI and device noise are the three main interference modes in wired communication systems: ESD can damage or destroy active and passive devices inside and outside the circuit; EMI/RFI can affect the system's signal processing, and in severe cases can cause the failure of the system's basic functions; the noise generated by the device can affect the operation of the circuit, reduce its performance, and may also cause system failure.
Technical Challenges of Adaptive Equalizer Design
Designing a robust system that can handle the above interference is a challenge. Adaptive cable equalizers are not simple digital devices, which is a basic fact that designers must carefully consider. National Semiconductor's CLC014, CLC012 and the latest CLC034 adaptive equalizers are high-performance analog devices. They are high-gain, high-bandwidth, analog, RF, AGC amplifier filters. When properly integrated, they can work with all other system components (including chassis, passive components and PCB, etc.) to resist internal and external interference. In general, when the cable length is the maximum, the signal received by the equalizer is the minimum. Therefore, the gain and bandwidth of the equalizer should be at the maximum value. However, when the input is not connected and there is no external signal, the gain and bandwidth are also maximum. At maximum gain, even a small amount of harmful EMI or conducted interference will be greatly amplified, affecting the normal operation of the equalizer. Good PCB design can prevent interference and avoid some common equalizer application failures, such as: inability to equalize the maximum cable length at a given data rate; data errors when the cable length is less than the maximum value; false or random output data when the input is open; signal detection error indication.
These failures are caused by: EMI radiation from within the system chassis or on the PCB; noise coupled to the input from logic devices or power supplies through the component mounting pins of the input network; crosstalk from other nearby circuits to the input and/or adaptive equalizer circuit (AEC); coupling from the equalizer input and output circuits. ESD events can severely damage semiconductor devices, especially when they are not protected by conductive packaging materials, and even when the semiconductor devices are mounted on the circuit. Devices used for direct cable interface, such as line drivers and cable equalizers, are designed to the maximum ESD rating. Even so, it is unwise to rely solely on the semiconductor device itself to provide all ESD protection, regardless of its rated ESD protection value. The equalizer input circuit has the advantage of a low impedance path to ground through a termination resistor, which improves ESD tolerance. The components used in the input circuit should have sufficient ESD resistance to cope with the maximum ESD event in the design. With proper selection and design, all circuit components (including chassis, connectors, and PCBs) can provide ESD protection for the equalizer and other interface devices.
Design Methods to Improve Performance
The following design measures can resist electronic interference and improve the overall performance of the equalizer: 1. Isolate or shield the equalizer input network and AEC circuit from external and high-level signals on the card; 2. Use durable input circuit components to suppress ESD events; 3. Use multi-layer PCBs with independent transmission lines and power-ground layers to achieve isolation, shielding and ESD protection; 4. Use thin dielectrics (less than 6 mils) between the power and ground layers to increase inter-layer capacitance and high-frequency attenuation; 5. Use two vias when connecting bypass capacitors, termination resistors, collector load resistors, and VCC and VEE pin pads to the layer; 6. Do not connect multiple VCC and VEE pins to one via, as this may cause noise in the device.
Figure 1 shows the recommended CLC014 equalizer circuit, and Figure 2 shows the corresponding PCB layout. On the PCB board, some measures are taken to isolate the equalizer circuit from harmful signal interference. The copper foil is removed from the power layer under the input network and AEC capacitor to eliminate the path for the power layer noise to couple to the input circuit and AEC circuit. Part of the copper foil (dark shadow line) is removed from all layers to isolate the equalizer circuit. These isolation strips can prevent adjacent circuits from directly contacting the equalizer circuit through the middle layer. In this way, the interference signal must take a long path along the isolation strip to approach the input circuit.
This increases the low-pass filtering effect and improves the ability to attenuate harmful signals. The cable driver used to provide the signal loop-back function is often placed adjacent to the equalizer. The output signal of the cable driver is much stronger than the signal received by the equalizer. The isolation strip helps to isolate the cable driver signal and reduce interference with the equalizer input signal. Around the input circuit is a well-grounded guard (shield) ring to reduce the RFI picked up, as shown in Figure 2a. The guard ring can also be replaced by copper on the outer layer of the PCB, as shown in Figure 2b. The copper must connect all ground layers with a spacing of about 1cm to form an effective shield. The common-mode rejection of the equalizer differential input amplifier and the symmetrical input component layout can also enhance RFI rejection. RFI is a common-mode signal when it is received by both input terminals at the same time. A symmetrical input circuit layout with balanced termination impedance allows the RFI signal to reach both input terminals evenly, so that the common-mode rejection function of the input differential amplifier can eliminate most of the interfering signals.
Previous article:A design of high-gain and low-noise image detector readout circuit
Next article:LED lighting safety testing method
- "Cross-chip" quantum entanglement helps build more powerful quantum computing capabilities
- Why is the vehicle operating system (Vehicle OS) becoming more and more important?
- Car Sensors - A detailed explanation of LiDAR
- Simple differences between automotive (ultrasonic, millimeter wave, laser) radars
- Comprehensive knowledge about automobile circuits
- Introduction of domestic automotive-grade bipolar latch Hall chip CHA44X
- Infineon Technologies and Magneti Marelli to Drive Regional Control Unit Innovation with AURIX™ TC4x MCU Family
- Power of E-band millimeter-wave radar
- Hardware design of power supply system for automobile controller
Professor at Beihang University, dedicated to promoting microcontrollers and embedded systems for over 20 years.
- Intel promotes AI with multi-dimensional efforts in technology, application, and ecology
- ChinaJoy Qualcomm Snapdragon Theme Pavilion takes you to experience the new changes in digital entertainment in the 5G era
- Infineon's latest generation IGBT technology platform enables precise control of speed and position
- Two test methods for LED lighting life
- Don't Let Lightning Induced Surges Scare You
- Application of brushless motor controller ML4425/4426
- Easy identification of LED power supply quality
- World's first integrated photovoltaic solar system completed in Israel
- Sliding window mean filter for avr microcontroller AD conversion
- What does call mean in the detailed explanation of ABB robot programming instructions?
- STMicroelectronics discloses its 2027-2028 financial model and path to achieve its 2030 goals
- 2024 China Automotive Charging and Battery Swapping Ecosystem Conference held in Taiyuan
- State-owned enterprises team up to invest in solid-state battery giant
- The evolution of electronic and electrical architecture is accelerating
- The first! National Automotive Chip Quality Inspection Center established
- BYD releases self-developed automotive chip using 4nm process, with a running score of up to 1.15 million
- GEODNET launches GEO-PULSE, a car GPS navigation device
- Should Chinese car companies develop their own high-computing chips?
- Infineon and Siemens combine embedded automotive software platform with microcontrollers to provide the necessary functions for next-generation SDVs
- Continental launches invisible biometric sensor display to monitor passengers' vital signs
- Issues with chip drive power and load size
- [NXP Rapid IoT Review] NO1. First experience with NXP Rapid LoT development kit
- [TI recommended course] #TPS65086100: User programming of multi-rail power management IC#
- DAC analog multiplier, DDS (frequency synthesizer), signal generator
- For beginners of TI 6000 series DSP
- MSP430F6638 MCU interrupt, clock and low power consumption
- How to draw this circuit in dxp
- 【CH579M-R1】2. SYSTICK + GPIO + INT
- Microchip Live at 10:00 today: MCU programming is no longer difficult, use MPLAB Code Configurator (MCC) to achieve rapid development
- Application of rotary transformer-digital converter AD2S83 in servo system