CarConnect and Bosch, the "A+B" combination in the smart cockpit domain control track

Cross-domain integration will definitely be realized within 5 years

As the automotive electronic and electrical architecture moves from distributed to centralized, cross-domain integration has begun to appear in the industry, such as the integration of autonomous driving and smart cockpit domains.

Currently, Autolink and Bosch have begun to jointly develop the 8295 chip platform of Qualcomm Snapdragon 4. This platform is a next-generation cross-domain fusion product based on the 8155 chip of Qualcomm Snapdragon 3. It is a higher-level technology that combines the smart cockpit domain with a certain smart driving domain.

Based on this platform, Bosch is collaborating on projects with Daimler in the global market. In the Chinese market, Bosch and Autolink have also begun in-depth communication with several mainstream manufacturers in China.

"The next generation of Qualcomm's cockpit chips already have a certain amount of AI computing power, which is prepared for some low-speed autonomous driving functions. Once we start cooperating on this product, we will naturally enter into cooperation on autonomous driving domain control." Li Yin said.

He believes that the cross-domain integration of autonomous driving and smart cockpits will definitely be realized within five years, but there are two major difficulties now. "The first is chips. There are no chips that can support this yet. The second is software. There are still many incompatibilities in the software on the market."

Li Yin believes that these two difficulties may be solved within three or five years. "However, even if cross-domain integration is achieved, it is only in high-end intelligent vehicles. There are still many relatively basic autonomous driving functions and relatively basic cockpit functions that do not need to be combined, which will also account for a large market share."