Sequoia China leads the investment, Boliu Intelligence efficiently completes Series B financing

Mr. Yonghua Song, founder of Bouffalo Lab, is a founding member of Marvell in Silicon Valley. He was formerly the Vice President of Global R&D at Marvell. He has been engaged in integrated circuit design for more than 20 years, and has participated in the design and leadership of nearly 100 integrated circuit chip R&D projects, with a cumulative design and R&D chip output value of more than 10 billion US dollars. He has more than 60 US invention patents and has published relevant papers at the top integrated circuit design summits ISSCC and IEEE European Solid-State Circuits Conference (ESSCIRC).

Founded in late 2016, Boliu Intelligence focuses on developing system chips and overall solutions in the fields of ultra-low power consumption, smart IoT and edge computing. Over the past three years, Boliu Intelligence has successfully developed core technologies in multiple chip fields, including multi-mode wireless connection technology (WiFi/BT/Zigbee), artificial intelligence algorithms and hardware acceleration technology (NPU), and ultra-low power embedded SOC integrated platforms, which can fully realize single-chip integrated AIoT/edge computing SOC system chips.

In 2019, Bolu Intelligent successfully mass-produced the first wireless WiFi AIoT SOC chip. Its ultra-low power consumption, high integration, ultra-long transmission distance, high cost performance, as well as its security and intelligence, have allowed this chip to quickly enter the consumer and home appliance market. Just as the founder advocated "accumulation and development, long history", the technical development capabilities and product mass production execution capabilities of the Bolu Intelligent team benefit from their practical experience and accumulation in serving first-class customers such as Apple, Google, Samsung, Huawei, Microsoft and Sony for a long time. The team has invested a lot of energy in polishing technical performance and has been striving for excellence in products. Not only has the RF performance of the chip been made the best in the world, and it can transmit farther than competing products (penetrating one more wall), but it has also done a lot of testing and certification in terms of the stability and adaptability of the hardware and software systems, which has won high praise from customers.

In the midst of a capital winter, when financing is extremely difficult and lengthy, Boliu Intelligence exceeded the target for its Series B financing in a very short period of time. This shows that first-tier VCs fully recognize Boliu's strategic direction, unique competitive advantages in the field, and strong execution capabilities.

With sufficient funds, the mass production and delivery of multiple products this year and efficient cost control capabilities, Bolu Intelligence has greatly enhanced its ability to withstand the financial risks brought by the capital winter, and also laid a solid financial foundation for Bolu Intelligence's next step of rapid development against the trend. At present, while strengthening product marketing, the team is accelerating the development of a new generation of AIoT/edge computing system chip products to upgrade and iterate to the latest wireless technologies such as WiFi6/BLE5.X and RISC-V/new generation NPU computing platforms.

Bolu Intelligence has established R&D centers in Nanjing Jiangbei New District, Shanghai Zhangjiang Hi-Tech Park, and Hsinchu, Taiwan. The current team size is nearly 100 people, bringing together a group of outstanding technical talents from well-known companies in the industry. The company's R&D team consists of doctors and masters from prestigious universities, and have worked in internationally renowned chip design companies. Most of them have about ten years of practical R&D experience. Bolu Intelligence's team technology is comprehensive and complete, including communication and AI system algorithms, analog, RF, digital, SOC and embedded development, etc. The R&D products cover multiple market application fields, such as wireless connection, embedded and artificial intelligence, etc.