Car companies also make Chinese chips; domestic lithography machine factories are refuted; Europe's "Chip Act" comes into effect丨A quick overview of the week
Latest update time：2023-09-23
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A week has passed, and earth-shaking changes have taken place in the electronic world. We have gathered the information worth paying attention to this week and read the major events of the week in one article. If you have any suggestions for the "Weekly Quick Facts" column or what you would like to see, please feel free to make your suggestions.
Produced by Electronic Engineering World (ID: EEWorldbbs)丨
Special attention
Chinese lithography factory? Fake
The rumors about China's lithography factory became increasingly outrageous. Finally, China Electronics Engineering Design Institute Co., Ltd. (China Electronics Institute) also came forward to clarify that the project was not a domestic lithography machine factory as reported online, but a Beijing high-energy synchrotron radiation light source project. (HEPS).
HEPS is located on the bank of Yanqi Lake in Huairou, Beijing. It is a major scientific and technological infrastructure for the country's "13th Five-Year Plan". It is my country's first high-energy synchrotron radiation light source and one of the brightest fourth-generation synchrotron radiation light sources in the world. As early as 2019 Just start building. It will be put into use by the end of 2025.
This week, Electronic Engineering World also wrote an analysis. For details, you can read "
A New Breakthrough in EUV Lithography, Is it Real?"
》.
Real photos of Beijing High Energy Synchrotron Radiation Light Source Project
NIO makes mobile phones and chips
Cross-border is the key word for enterprises now. In the past two years, it was popular for Internet companies to cross-border manufacturing cores. Now, it is car companies making cross-border mobile phones and chips.
On September 21, NIO released the NIO Phone, which is divided into performance version for 6,499 yuan (12GB+512GB), flagship version for 6,899 yuan (12GB+1TB) and special edition (EPedition) for 7,499 yuan (16GB+1TB). . NIO Phone is equipped with Qualcomm Snapdragon 8 Gen 2 leading version processor, equipped with a 6.81-inch/2K/E6 material Samsung curved screen, supporting 1Hz~120Hz variable refresh rate and P3 color gamut display.
In addition, Weilai released its self-developed lidar main control chip "Yang Jian", which is an 8-core 64-bit processor, equipped with an 8-channel 9-bit ADC, with a sampling rate of up to 1GHz, which can capture the original data of lidar sensors and reduce the cost of lidar by 50%. % power consumption, the chip will be mass-produced in October.
Crossovers are not uncommon in the photovoltaic field. For example, Tongwei has always had a place in the market by leveraging its advantages from silicon materials to silicon wafers. The same is true for Weilai's cross-border manufacturing of mobile phones and chips. The longer the industry chain, the easier it will be to build ecological and industrial advantages. However, mobile phones and chips are different from traditional industries. The cost recovery period is long and the market competition is fierce. It will take time to tell whether cross-border is a good thing.
Europe’s Chip Act officially comes into effect
CCTV News reported on September 21 that the European "Chip Act" officially came into effect on that day. The European Commission announced that the program promotes the industrialization of key technologies through the "European Chip Plan" and encourages public and private enterprises to invest in the manufacturing facilities of chip manufacturers and their suppliers.
The announcement shows that Europe accounts for less than 10% of the global semiconductor production market and relies heavily on third-country suppliers. If global supply chains are severely disrupted, the European industrial sector could be depleted within a short period of time, bringing European industry to a standstill.
According to the Chip Act, the EU will bring together 11.15 billion euros in public investment from EU institutions and member states by 2030, and will leverage large amounts of private investment. In July this year, the European Parliament passed the Chip Act. The bill requires that the EU's global chip production share should be increased from the current 10% to 20% by 2030 to meet its own and world market needs.
According to
the analysis of the CCCEU (China Chamber of Commerce in the European Union)
, the impact of the European "Chip Act" on Chinese companies includes: first, it makes it more difficult for companies to enter the EU market; second, it causes Chinese chip companies
to face ; third, technical cooperation is restricted. , restricting technical exchanges and cooperation between China and Europe.
According to the analysis of the article "Causes, Countermeasures and Enlightenments of the
"
EU Semiconductor Crisis"
", "Policy and Management Research", Issue 2, 2023 of "Proceedings of the Chinese Academy of Sciences"
, the layout of the EU semiconductor value chain is uneven, and the EU chip industry policy focuses on financial support. , insufficient public intervention and strategic integration in market-oriented supply chains. The author analyzes that compared with the European Union, my country's administrative intervention in market activities in the practice of socialist market economic system is more flexible and diverse, and it is necessary to combine respect for market laws with comprehensive rule of law to promote the development of the semiconductor industry and regulatory policies. Legalization, institutionalization and standardization will enable it to play the role of stabilizing and managing market expectations.
Cisco continues to buy, buy, buy
On September 21, Cisco announced the acquisition of Splunk. The cash transaction was worth approximately US$28 billion (204.7 billion yuan), and the purchase price was US$157 per share.
This acquisition is one of Cisco's largest acquisitions, continuing Cisco's crazy acquisition momentum and strengthening the company's network security products. In 2023 alone, Cisco acquired four companies: threat detection platform Armorblox, identity management company Oort, and two cloud security companies Valtix and Lightspin.
Last year, news began to reveal this acquisition, and now, the scandal has become true.
Create new trends
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Samsung will produce Exynos application processors at its Taylor plant in the United States, using a 4nm process;
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Google will launch the Tensor G5 chip for its Pixel mobile phone series. The foundry partner will be switched from Samsung to TSMC. However, the mass production schedule has been postponed from 2024 to 2025. TSMC will not comment on relevant reports;
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TSMC’s Hsinchu Baoshan 2nm plant construction plan has slowed down and will be postponed to mass production in 2026;
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Nanya follows up with DRAM original manufacturers to adjust production capacity, reduce utilization rates, flexibly adjust product mix and capital expenditures, and dynamically adjust according to customer needs and market changes to cope with market weakness. It is expected that production capacity will be dynamically reduced by less than 20%.
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SEMI: In order to meet future market demand, suppliers such as Bosch, Infineon, Mitsubishi, ON Semiconductor, and STMicroelectronics are accelerating their 8-inch factory production capacity. It is estimated that from 2023 to 2026, the 8-inch production capacity of automotive and power semiconductors will An increase of 34%.
The organization has new data
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TrendForce: AI stimulates the related supply chain stocking boom. In addition to driving the revenue of the world's top ten IC design companies to US$38.1 billion in the second quarter, a month-on-month increase of 12.5%;
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IDC: It is expected that the global semiconductor market will return to the growth track in 2024 and will increase by 20.7% year-on-year to US$625.9 billion;
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Some MCU materials and parts have been restocked, and MCU factories have seen price increases for some materials and parts, with prices gradually bottoming out. However, the overall destocking has not ended, and the inventory will not return to normal levels until the end of the year or the first half of next year;
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Storage manufacturers have confirmed that they will increase Q4 contract prices. NAND flash and DRAM almost all have double-digit increases;
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SEMI: It is expected that from 2023 to 2026, the production capacity of global semiconductor manufacturers’ 200mm wafer fabs will increase by 14%;
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Omdia: Nvidia’s H100 shipments reached 900 tons in the second quarter, equivalent to 300,000 pieces;
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DIGITIMES: Taiwan's wafer foundry industry revenue is expected to be US$77.9 billion this year, a 13% decline, and is expected to rebound next year.
This information is also worthy of attention
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Market rumors continue
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OPPO responds to rumors of restarting chip design business: No comment;
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Jin Yuzhi, President of Huawei's Optical Product Line, will take over as CEO of Auto BU, while Yu Chengdong will become Chairman of Auto BU;
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Honor CEO Zhao Ming: At present, Honor has no plans to develop SoC chips and it is absolutely impossible to return to Huawei;
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Qualcomm's Shanghai company was exposed to large-scale layoffs, with a maximum compensation of N+7 and no triple cap limit. Qualcomm responded that it is expected that the Shanghai company will lay off employees, but it is not true to "large-scale", "evacuate Shanghai" and "close offices";
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Lots of new products
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Intel has released its latest PC processor Meteor Lake, which is the first product of Core Ultra processor. It can run generative AI chatbots on laptops without having to use cloud data centers to obtain computing power. Core Ultra will be released on December 14;
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Intel has launched the industry's first glass substrate for next-generation advanced packaging, aiming to increase the upper limit of the number of transistors in a single package chip to 1 trillion by 2030. The current mass production technology is still immature and is still being developed in the laboratory. middle;
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Intel announced the expansion of its FPGA product line, the expansion of its Programmable Solutions Group (PSG) product line, and the addition of RISC-V processor design and other updates;
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AMD announced the launch of its new AMD Kria K24 system-on-module (SOM) for industrial and commercial edge applications;
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Sony Semiconductor Solutions (SSS) has developed an energy harvesting module that utilizes electromagnetic wave noise energy. This technology can utilize constant electromagnetic waves generated by robots in factories, monitors and lighting in offices, monitors and TVs in stores and homes, etc. noise to provide the stable power needed to run low-power IoT sensors;
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Four departments (the Ministry of Finance, the State Administration of Taxation, the National Development and Reform Commission, and the Ministry of Industry and Information Technology): increase the super deduction ratio for R&D expenses of integrated circuit and industrial machine companies;
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Our country’s scientific research team has made important progress in two-dimensional high-performance floating-gate transistor memory;
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Nexperia announced its commitment to becoming carbon neutral by 2035 in terms of its direct operational emissions and indirect emissions from procuring energy for operations;
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The craze for ChatGPT is gradually receding, and the demand for Microsoft 365 Copilot is not as strong as before. Microsoft has begun to reduce orders for Nvidia H100 chips;
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The Korean government will invest 2.2 trillion won to develop advanced industrial clusters.
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Researchers at the University of Pennsylvania School of Engineering and Applied Science have fabricated a high-performance two-dimensional semiconductor into full-size, industrial-scale wafers. In addition, the semiconductor material indium selenide (InSe) can be used at low enough temperatures to deposition so that it can be integrated with silicon chips, the research was recently published in the journal Materials.
primary market
There are 17 noteworthy financing events in the field of electronic engineering this week, with projects focusing on laser technology, semiconductor IP, and optoelectronic devices.
Among them, Yancun Technology deserves attention. The investors in this Series A round also include Juchen Semiconductor Co., Ltd., Youyuan Capital, Zhongji Investment, and BV Baidu Venture Capital.
According to the official introduction, in response to the intelligent needs of the edge side and the terminal side, Gencun Technology has laid out two core products: "independent MRAM storage chip" and "AI SoC chip" containing embedded MRAM around "storage-computing-control". line, providing competitive, energy-efficient, intelligent single-chip series solutions to customers in consumer, industrial, Internet of Things, automotive and other fields. Among them, the "ultra-low power consumption" version of AI SoC operates with power consumption as low as 5uA/MHz, reaching the world's first-class level, and can provide cost-effective solutions for a wide range of battery-powered application scenarios.
The MRAM market is expected to expand significantly and is expected to be worth US$19.1893 billion by 2031, growing at a CAGR of 36.6% from 2021 to 2031. According to the survey, markets including the automotive market and the Internet of Things are areas with the highest growth momentum for MRAM. MRAM's fast, non-volatile storage capabilities have also increased the storage market's demand for MRAM as a reliable and effective storage solution. In the future, MRAM may even be used to replace SRAM and DRAM.
Another company worthy of attention is Guohua Materials Technology, which received about 100 million yuan in Series A financing. In the iterative development of 3G, 4G and 5G, Guohua Materials Technology is the main supplier of world-renowned communication equipment manufacturers Ericsson, Nokia, ZTE, etc. business. According to the official website, Guohua Materials Technology focuses on high-tech research results and is committed to the R&D and production of high-tech, high value-added, cutting-edge functional ceramic materials and new microwave communication devices. It has a full industrial chain layout from powder to filters. , occupying the largest market share of dielectric resonators in the world.
The microwave dielectric ceramic industry is overall in the upstream of the 5G industry chain. The 5G plans of various provinces and cities focus on the breakthrough and development of key technologies and core components such as 5G upstream radio frequency components and active array antennas, and have formulated all-round support policies, which will Drive the rapid development of microwave dielectric ceramic components. There are high production technical barriers in the microwave dielectric ceramic industry. The number of companies in the industry is small and the overall supply capacity is weak, which to a certain extent restricts the large-scale development of the industry. China's microwave dielectric ceramic materials market size was 5.23 billion yuan in 2019, approximately 6.64 billion yuan in 2020, and is expected to reach 15.62 billion yuan by 2023.
Secondary market
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Tuojing Technology: PE-ALD equipment has achieved mass production, and Thermal-ALD equipment is being verified on the client side;
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Huahong Company announced on September 20 that it plans to use the raised funds to increase capital of 12.632 billion yuan in its wholly-owned subsidiary Huahong Grace. This amount accounts for approximately 60% of the company’s net proceeds from the IPO. Part of the raised funds will be used. Yu Huahong Hongli increased capital to Huahong Semiconductor Manufacturing (Wuxi) Co., Ltd., which is the implementation entity of the Huahong Manufacturing (Wuxi) project. The remaining funds raised will be used for the 8-inch factory optimization and upgrading project and the characteristic process technology innovation research and development project. and supplement working capital;
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On September 21, the media broke the news that technology giant Google was considering giving up Broadcom as its artificial intelligence (AI) chip supplier as early as 2027. After the news was announced, Broadcom's stock price plunged 8% before the market opened that day, with its lowest price per day. The stock price was US$761, and the decline has now narrowed to 6%, to US$781 per share.
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