Packaging terminology analysis (from "PCB Terminology Manual" V1.0)1. BGA (ball grid array)is a spherical contact array, one of the surface mount packages. Spherical bumps are made on the back of the
Linux has occupied half of the embedded operating system market with its advantages such as open source, high efficiency, customizability and small kernel. The wide application of embedded Linux in th
[Urgent recruitment] Shanghai AGV company is urgently recruiting a large number of implementation engineers. Monthly salary: 4,000-7,000 yuan. Job responsibilities: (1) AGV on-site construction; (2) W
Watch the keynote speech by RohdeSchwarz to get a more intuitive understanding of 5G and win prizes!Click to watchEvent time: From now until March 25, 2020
Activity Description:
1. Click on the video