|
MAX4751EUD+ |
MAX4751EGE+ |
MAX4752EGE+T |
MAX4753EUD+ |
MAX4751EGE+T |
Description |
analog switch ics 0.9ohm quad spst analog switch |
analog switch ics 0.9ohm quad spst analog switch |
analog switch ics 0.9ohm quad spst analog switch |
analog switch ics 0.9ohm quad spst analog switch |
analog switch ics 0.9ohm quad spst analog switch |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
Maxim |
Maxim |
Maxim |
Maxim |
Maxim |
Parts packaging code |
TSSOP |
QFN |
QFN |
TSSOP |
QFN |
package instruction |
TSSOP, TSSOP14,.25 |
VQCCN, LCC16,.12SQ,20 |
VQCCN, LCC16,.12SQ,20 |
TSSOP, TSSOP14,.25 |
VQCCN, LCC16,.12SQ,20 |
Contacts |
14 |
16 |
16 |
14 |
16 |
Reach Compliance Code |
compliant |
compli |
compli |
compli |
compli |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Factory Lead Time |
6 weeks |
6 weeks |
6 weeks |
6 weeks |
6 weeks |
Analog Integrated Circuits - Other Types |
SPST |
SPST |
SPST |
SPST |
SPST |
JESD-30 code |
R-PDSO-G14 |
S-CQCC-N16 |
S-CQCC-N16 |
R-PDSO-G14 |
S-CQCC-N16 |
JESD-609 code |
e3 |
e3 |
e3 |
e3 |
e3 |
length |
5 mm |
4 mm |
4 mm |
5 mm |
4 mm |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
1 |
normal position |
NO |
NO |
NC |
NO/NC |
NO |
Number of channels |
1 |
1 |
1 |
1 |
1 |
Number of functions |
4 |
4 |
4 |
4 |
4 |
Number of terminals |
14 |
16 |
16 |
14 |
16 |
On-state resistance matching specifications |
0.05 Ω |
0.05 Ω |
0.05 Ω |
0.05 Ω |
0.05 Ω |
Maximum on-state resistance (Ron) |
2.5 Ω |
2.5 Ω |
2.5 Ω |
2.5 Ω |
2.5 Ω |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
output |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
Package body material |
PLASTIC/EPOXY |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
PLASTIC/EPOXY |
CERAMIC, METAL-SEALED COFIRED |
encapsulated code |
TSSOP |
VQCCN |
VQCCN |
TSSOP |
VQCCN |
Encapsulate equivalent code |
TSSOP14,.25 |
LCC16,.12SQ,20 |
LCC16,.12SQ,20 |
TSSOP14,.25 |
LCC16,.12SQ,20 |
Package shape |
RECTANGULAR |
SQUARE |
SQUARE |
RECTANGULAR |
SQUARE |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
CHIP CARRIER, VERY THIN PROFILE |
CHIP CARRIER, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
CHIP CARRIER, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
power supply |
1.8/3 V |
1.8/3 V |
1.8/3 V |
1.8/3 V |
1.8/3 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.1 mm |
1 mm |
1 mm |
1.1 mm |
1 mm |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
1.6 V |
1.6 V |
1.6 V |
1.6 V |
1.6 V |
Nominal supply voltage (Vsup) |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
Maximum disconnect time |
25 ns |
25 ns |
25 ns |
25 ns |
25 ns |
Maximum connection time |
35 ns |
35 ns |
35 ns |
35 ns |
35 ns |
switch |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Terminal form |
GULL WING |
NO LEAD |
NO LEAD |
GULL WING |
NO LEAD |
Terminal pitch |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
Terminal location |
DUAL |
QUAD |
QUAD |
DUAL |
QUAD |
Maximum time at peak reflow temperature |
30 |
30 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
4.4 mm |
4 mm |
4 mm |
4.4 mm |
4 mm |