Telecom Circuit, 1-Func, CMOS, PQFP80, PLASTIC, MQFP-80
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Intel |
package instruction | QFP, |
Reach Compliance Code | compliant |
JESD-30 code | S-PQFP-G80 |
JESD-609 code | e0 |
length | 14 mm |
Number of functions | 1 |
Number of terminals | 80 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | QFP |
Package shape | SQUARE |
Package form | FLATPACK |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 2.45 mm |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | CMOS |
Telecom integrated circuit types | TELECOM CIRCUIT |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 14 mm |
Base Number Matches | 1 |
PSB4860 | |
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Description | Telecom Circuit, 1-Func, CMOS, PQFP80, PLASTIC, MQFP-80 |
Is it Rohs certified? | incompatible |
Maker | Intel |
package instruction | QFP, |
Reach Compliance Code | compliant |
JESD-30 code | S-PQFP-G80 |
JESD-609 code | e0 |
length | 14 mm |
Number of functions | 1 |
Number of terminals | 80 |
Maximum operating temperature | 70 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | QFP |
Package shape | SQUARE |
Package form | FLATPACK |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 2.45 mm |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | CMOS |
Telecom integrated circuit types | TELECOM CIRCUIT |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 14 mm |
Base Number Matches | 1 |