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S29GL512T10FHB043

Description
Flash
Categorystorage    storage   
File Size9MB,105 Pages
ManufacturerCypress Semiconductor
Environmental Compliance
Download Datasheet Parametric Compare View All

S29GL512T10FHB043 Overview

Flash

S29GL512T10FHB043 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerCypress Semiconductor
package instructionLBGA,
Reach Compliance Codecompli
Maximum access time100 ns
Spare memory width1
JESD-30 codeR-PBGA-B64
length13 mm
memory density536870912 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals64
word count67108864 words
character code64000000
Operating modeASYNCHRONOUS
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
organize64MX8
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Programming voltage2.7 V
Filter levelAEC-Q100
Maximum seat height1.4 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width11 mm
Base Number Matches1

S29GL512T10FHB043 Related Products

S29GL512T10FHB043 S29GL512T10FHB040 S29GL512T10FHA010 S29GL512T10FHB030
Description Flash Flash Flash, 32MX16, 100ns, PBGA64, FBGA-64 Flash
Is it Rohs certified? conform to conform to conform to conform to
package instruction LBGA, LBGA, LBGA, LBGA,
Reach Compliance Code compli compliant compliant compliant
Maximum access time 100 ns 100 ns 100 ns 100 ns
Spare memory width 1 1 8 1
JESD-30 code R-PBGA-B64 R-PBGA-B64 R-PBGA-B64 R-PBGA-B64
length 13 mm 13 mm 13 mm 13 mm
memory density 536870912 bi 536870912 bit 536870912 bit 536870912 bit
Memory IC Type FLASH FLASH FLASH FLASH
memory width 8 8 16 8
Number of functions 1 1 1 1
Number of terminals 64 64 64 64
word count 67108864 words 67108864 words 33554432 words 67108864 words
character code 64000000 64000000 32000000 64000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 105 °C 105 °C 85 °C 105 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
organize 64MX8 64MX8 32MX16 64MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA LBGA LBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Programming voltage 2.7 V 2.7 V 2.7 V 2.7 V
Filter level AEC-Q100 AEC-Q100 AEC-Q100 AEC-Q100
Maximum seat height 1.4 mm 1.4 mm 1.4 mm 1.4 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
width 11 mm 11 mm 11 mm 11 mm
Base Number Matches 1 1 1 1
Is Samacsys - N N N

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