fpga - field programmable gate array fpga - flex 10k 624 labs 191 ios
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Altera (Intel) |
Parts packaging code | BGA |
package instruction | 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 |
Contacts | 256 |
Reach Compliance Code | _compli |
ECCN code | 3A991 |
JESD-30 code | S-PBGA-B256 |
JESD-609 code | e0 |
length | 17 mm |
Humidity sensitivity level | 3 |
Number of I/O lines | 191 |
Number of entries | 191 |
Number of logical units | 4992 |
Output times | 191 |
Number of terminals | 256 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 191 I/O |
Output function | MIXED |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA256,16X16,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 220 |
power supply | 2.5,2.5/3.3 V |
Programmable logic type | LOADABLE PLD |
propagation delay | 0.5 ns |
Certification status | Not Qualified |
Maximum seat height | 2.1 mm |
Maximum supply voltage | 2.625 V |
Minimum supply voltage | 2.375 V |
Nominal supply voltage | 2.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn63Pb37) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 17 mm |