IC MCU 32BIT 256KB FLASH 64UFBGA
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Objectid | 8298065921 |
package instruction | UFBGA-64 |
Reach Compliance Code | compliant |
Country Of Origin | Thailand |
ECCN code | 3A991.A.2 |
Factory Lead Time | 52 weeks |
Date Of Intro | 2017-11-30 |
YTEOL | 7.2 |
Has ADC | YES |
Address bus width | |
bit size | 32 |
boundary scan | YES |
CPU series | CORTEX-M0 |
maximum clock frequency | 32 MHz |
DAC channel | YES |
DMA channel | NO |
External data bus width | |
Format | FIXED POINT |
Integrated cache | YES |
JESD-30 code | S-PBGA-B64 |
JESD-609 code | e3 |
length | 5 mm |
low power mode | YES |
Number of external interrupt devices | 16 |
Number of I/O lines | 52 |
Number of serial I/Os | |
Number of terminals | 64 |
Number of timers | 8 |
On-chip data RAM width | 8 |
On-chip program ROM width | 8 |
Maximum operating temperature | 105 °C |
Minimum operating temperature | -40 °C |
PWM channel | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Encapsulate equivalent code | BGA64,8X8,20 |
Package shape | SQUARE |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | 260 |
RAM (bytes) | 32768 |
RAM (number of words) | 32768 |
rom(word) | 262144 |
ROM programmability | FLASH |
Maximum seat height | 0.65 mm |
speed | 48 MHz |
Maximum slew rate | 92 mA |
Maximum supply voltage | 3.63 V |
Minimum supply voltage | 1.62 V |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | BALL |
Terminal pitch | 0.5 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 5 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER, RISC |