data converter systems sawnwafer(Au-bumped)
| Parameter Name | Attribute value |
| Brand Name | NXP Semiconduc |
| Is it Rohs certified? | conform to |
| Maker | NXP |
| Parts packaging code | WAFER |
| package instruction | DIE, |
| Contacts | 8 |
| Manufacturer packaging code | NAU000 |
| Reach Compliance Code | compli |
| JESD-30 code | R-XUUC-N8 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Package shape | RECTANGULAR |
| Package form | UNCASED CHIP |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | CMOS |
| Telecom integrated circuit types | TELECOM CIRCUIT |
| Temperature level | INDUSTRIAL |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
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