2 Megabit, 1 Megabit CMOS 3.0 Volt Flash Memory with 25 MHz SPI Bus Interface
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | SOIC |
| package instruction | SOP, SOP8,.3 |
| Contacts | 8 |
| Reach Compliance Code | compli |
| ECCN code | 3A991.B.1.B.1 |
| Maximum clock frequency (fCLK) | 25 MHz |
| Data retention time - minimum | 20 |
| Durability | 100000 Write/Erase Cycles |
| JESD-30 code | S-PDSO-G8 |
| JESD-609 code | e0 |
| length | 5.23 mm |
| memory density | 2097152 bi |
| Memory IC Type | FLASH |
| memory width | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 2MX1 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP8,.3 |
| Package shape | SQUARE |
| Package form | SMALL OUTLINE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 3/3.3 V |
| Programming voltage | 3 V |
| Certification status | Not Qualified |
| Maximum seat height | 2.03 mm |
| Serial bus type | SPI |
| Maximum standby current | 0.000003 A |
| Maximum slew rate | 0.02 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| type | NOR TYPE |
| width | 5.23 mm |
| write protect | HARDWARE/SOFTWARE |
| Base Number Matches | 1 |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD