2 Megabit, 1 Megabit CMOS 3.0 Volt Flash Memory with 25 MHz SPI Bus Interface
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Parts packaging code | SON |
| package instruction | HVSON, SOLCC8,.25 |
| Contacts | 8 |
| Reach Compliance Code | unknow |
| ECCN code | 3A991.B.1.B.1 |
| Is Samacsys | N |
| Maximum clock frequency (fCLK) | 25 MHz |
| Data retention time - minimum | 20 |
| Durability | 100000 Write/Erase Cycles |
| JESD-30 code | R-PDSO-N8 |
| JESD-609 code | e3 |
| length | 6 mm |
| memory density | 2097152 bi |
| Memory IC Type | FLASH |
| memory width | 1 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 2MX1 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HVSON |
| Encapsulate equivalent code | SOLCC8,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3/3.3 V |
| Programming voltage | 3 V |
| Certification status | Not Qualified |
| Maximum seat height | 0.75 mm |
| Serial bus type | SPI |
| Maximum standby current | 0.000003 A |
| Maximum slew rate | 0.02 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| type | NOR TYPE |
| width | 4.9 mm |
| write protect | HARDWARE/SOFTWARE |
| Base Number Matches | 1 |
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