IC Socket, DIP22, 22 Contact(s), 2.54mm Term Pitch, 0.9inch Row Spacing, Solder,
Parameter Name | Attribute value |
Reach Compliance Code | compli |
ECCN code | EAR99 |
Other features | LOW PROFILE, UL 94-HB |
body width | 1 inch |
subject depth | 0.165 inch |
body length | 1.1 inch |
Contact to complete cooperation | AU ON NI |
Contact completed and terminated | GOLD OVER NICKEL |
Contact material | BE-CU |
Contact style | RND PIN-SKT |
current rating | 3 A |
Device slot type | IC SOCKET |
Type of equipment used | DIP22 |
Shell material | GLASS FILLED POLYAMIDE |
JESD-609 code | e4 |
Plug contact pitch | 0.1 inch |
Installation method | STRAIGHT |
Number of contacts | 22 |
Maximum operating temperature | 125 °C |
PCB contact pattern | RECTANGULAR |
PCB contact row spacing | 0.9 mm |
Terminal pitch | 2.54 mm |
Termination type | SOLDER |
Base Number Matches | 1 |