Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | QCCJ, LDCC68,1.0SQ |
| Reach Compliance Code | unknow |
| JESD-30 code | S-PQCC-J68 |
| Number of terminals | 68 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 2.5/5 V |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| uPs/uCs/peripheral integrated circuit type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| SC16C554DIA68 | SC16C554IB80 | SC16C554IB64 | SC16C554DIB64 | SC16C554 | |
|---|---|---|---|---|---|
| Description | Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder | Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder | Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder | Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder | Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | - |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - |
| package instruction | QCCJ, LDCC68,1.0SQ | QFP, QFP80,.55SQ,20 | QFP, QFP64,.47SQ,20 | QFP, QFP64,.47SQ,20 | - |
| Reach Compliance Code | unknow | unknow | unknow | unknow | - |
| JESD-30 code | S-PQCC-J68 | S-PQFP-G80 | S-PQFP-G64 | S-PQFP-G64 | - |
| Number of terminals | 68 | 80 | 64 | 64 | - |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | - |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | QCCJ | QFP | QFP | QFP | - |
| Encapsulate equivalent code | LDCC68,1.0SQ | QFP80,.55SQ,20 | QFP64,.47SQ,20 | QFP64,.47SQ,20 | - |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | - |
| Package form | CHIP CARRIER | FLATPACK | FLATPACK | FLATPACK | - |
| power supply | 2.5/5 V | 2.5,3.3/5 V | 2.5/5 V | 2.5/5 V | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| surface mount | YES | YES | YES | YES | - |
| technology | CMOS | CMOS | CMOS | CMOS | - |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| Terminal form | J BEND | GULL WING | GULL WING | GULL WING | - |
| Terminal pitch | 1.27 mm | 0.5 mm | 0.5 mm | 0.5 mm | - |
| Terminal location | QUAD | QUAD | QUAD | QUAD | - |
| uPs/uCs/peripheral integrated circuit type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | - |
| JESD-609 code | - | e3 | e3 | e3 | - |
| Terminal surface | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - |
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