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MMSZ5240B

CategoryZener diode   
File Size465KB,2 Pages
ManufacturerJCET
Websitehttp://www.cj-elec.com/

Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); ​​QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

 

 

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MMSZ5240B Parametric

Parameter NameAttribute value
Diode configurationDetached
Stable voltage value (nominal value)10V
Stable voltage value (range)9.5V~10.5V
Accuracy-
power350mW
Reverse current (Ir)3μA@8V
Impedance(Zzt)17Ω

MMSZ5240B Preview

Download Datasheet
JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD
SOD-123 Plastic-Encapsulate Diodes
MMSZ5221B-MMSZ5259B
ZENER DIODE
FEATURES
• Planar Die Construction
• Ultra-Small Surface Mount Package
• General purpose, Medium Current
• Ideally Suited for Automated Assembly Processes
SOD-123
+
-
Maximum Ratings(T
a
=25℃ unless otherwise specified)
Characteristic
Forward Voltage (Note 2)
Power Dissipation(Note 1)
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
@ I
F
= 10mA
Symbol
V
F
P
d
R
θJA
T
j
,T
STG
Value
0.9
350
357
-65~ +150
2
Unit
V
mW
℃/W
Notes:1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm .
2. Tested with pulses, Tp≤1.0ms.
A,Jun,2011
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