Standard SRAM, 128KX8, 70ns, CMOS, PDSO32
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Objectid | 1164792257 |
| package instruction | TSSOP, TSSOP32,.56,20 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 70 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDSO-G32 |
| JESD-609 code | e0 |
| memory density | 1048576 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Humidity sensitivity level | 3 |
| Number of terminals | 32 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP32,.56,20 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3 V |
| Certification status | Not Qualified |
| reverse pinout | YES |
| Maximum standby current | 0.00001 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.04 mA |
| Nominal supply voltage (Vsup) | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| KM68U1000BLR-7L | KM68U1000BLG-7 | KM68U1000BLG-7L | KM68U1000BLR-7 | KM68U1000BLT-7 | |
|---|---|---|---|---|---|
| Description | Standard SRAM, 128KX8, 70ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 70ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 70ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 70ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 70ns, CMOS, PDSO32 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Objectid | 1164792257 | 1164792252 | 1164792251 | 1164792258 | 1164792264 |
| package instruction | TSSOP, TSSOP32,.56,20 | SOP, SOP32,.56 | SOP, SOP32,.56 | TSSOP, TSSOP32,.56,20 | TSSOP, TSSOP32,.56,20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 | 8 | 8 | 8 |
| Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 |
| Number of terminals | 32 | 32 | 32 | 32 | 32 |
| word count | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 | 128000 | 128000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSSOP | SOP | SOP | TSSOP | TSSOP |
| Encapsulate equivalent code | TSSOP32,.56,20 | SOP32,.56 | SOP32,.56 | TSSOP32,.56,20 | TSSOP32,.56,20 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 |
| power supply | 3 V | 3 V | 3 V | 3 V | 3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.00001 A | 0.00004 A | 0.00001 A | 0.00004 A | 0.00004 A |
| Minimum standby current | 2 V | 2 V | 2 V | 2 V | 2 V |
| Maximum slew rate | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA |
| Nominal supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V |
| surface mount | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.5 mm | 1.27 mm | 1.27 mm | 0.5 mm | 0.5 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 40 | 40 | 40 | 40 | 40 |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD