|
SN74CB3Q3251DGVR |
SN74CB3Q3251RGYR |
SN74CB3Q3251PWR |
SN74CB3Q3251PW |
SN74CB3Q3251DBQR |
SN74CB3Q3251PWG4 |
Description |
1-of-8 FET Multiplexer/Demultiplexer 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch 16-TVSOP -40 to 85 |
1-of-8 FET Multiplexer/Demultiplexer 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch 16-VQFN -40 to 85 |
1-of-8 FET Multiplexer/Demultiplexer 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch 16-TSSOP -40 to 85 |
1-of-8 FET Multiplexer/Demultiplexer 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch 16-TSSOP -40 to 85 |
1-of-8 FET Multiplexer/Demultiplexer 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch 16-SSOP -40 to 85 |
1-of-8 FET Multiplexer/Demultiplexer 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch 16-TSSOP -40 to 85 |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Parts packaging code |
SOIC |
QFN |
TSSOP |
TSSOP |
SOIC |
TSSOP |
package instruction |
TSSOP, TSSOP16,.25,16 |
HVQCCN, LCC16/20,.14X.16,20 |
TSSOP-16 |
TSSOP-16 |
SSOP, SSOP16,.25 |
TSSOP, TSSOP16,.25 |
Contacts |
16 |
16 |
16 |
16 |
16 |
16 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
compli |
series |
CB3Q/3VH/3C/2B |
CB3Q/3VH/3C/2B |
CB3Q/3VH/3C/2B |
CB3Q/3VH/3C/2B |
CB3Q/3VH/3C/2B |
CB3Q/3VH/3C/2B |
JESD-30 code |
R-PDSO-G16 |
R-PQCC-N16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
JESD-609 code |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
length |
3.6 mm |
4 mm |
5 mm |
5 mm |
4.9 mm |
5 mm |
Logic integrated circuit type |
MULTIPLEXER AND DEMUX/DECODER |
MULTIPLEXER AND DEMUX/DECODER |
MULTIPLEXER AND DEMUX/DECODER |
MULTIPLEXER AND DEMUX/DECODER |
MULTIPLEXER AND DEMUX/DECODER |
MULTIPLEXER AND DEMUX/DECODER |
Humidity sensitivity level |
1 |
2 |
1 |
1 |
2 |
1 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
Number of entries |
1 |
1 |
1 |
1 |
1 |
1 |
Output times |
8 |
8 |
8 |
8 |
8 |
8 |
Number of terminals |
16 |
16 |
16 |
16 |
16 |
16 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
Output polarity |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
HVQCCN |
TSSOP |
TSSOP |
SSOP |
TSSOP |
Encapsulate equivalent code |
TSSOP16,.25,16 |
LCC16/20,.14X.16,20 |
TSSOP16,.25 |
TSSOP16,.25 |
SSOP16,.25 |
TSSOP16,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
260 |
power supply |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
propagation delay (tpd) |
0.18 ns |
0.18 ns |
0.18 ns |
0.18 ns |
0.18 ns |
0.18 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.2 mm |
1 mm |
1.2 mm |
1.2 mm |
1.75 mm |
1.2 mm |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
2.3 V |
2.3 V |
2.3 V |
2.3 V |
2.3 V |
2.3 V |
Nominal supply voltage (Vsup) |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
GULL WING |
NO LEAD |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.4 mm |
0.5 mm |
0.65 mm |
0.65 mm |
0.64 mm |
0.65 mm |
Terminal location |
DUAL |
QUAD |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
4.4 mm |
3.5 mm |
4.4 mm |
4.4 mm |
3.9 mm |
4.4 mm |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
- |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
- |
Factory Lead Time |
1 week |
1 week |
6 weeks |
1 week |
1 week |
- |
method of packing |
TR |
TR |
TR |
TUBE |
TR |
- |
Maximum supply current (ICC) |
2 mA |
2 mA |
2 mA |
2 mA |
2 mA |
- |
Prop。Delay @ Nom-Sup |
0.12 ns |
0.12 ns |
0.12 ns |
0.12 ns |
0.12 ns |
- |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
- |