LM6121J/883 datasheet, PDF - EEWORLD Datasheet

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LM6121J/883: DescriptionBUFFER AMPLIFIER, PDSO14; CategoryAnalog mixed-signal IC Amplifier circuit; File Size286KB，10 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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LM6121J/883 Overview

BUFFER AMPLIFIER, PDSO14

LM6121J/883 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
Parts packaging code	DIP
package instruction	DIP, DIP8,.3
Contacts	8
Reach Compliance Code	unknow
ECCN code	EAR99
Amplifier type	BUFFER
Maximum average bias current (IIB)	7 µA
Nominal bandwidth (3dB)	50 MHz
Maximum bias current (IIB) at 25C	4 µA
Maximum input offset voltage	50000 µV
JESD-30 code	R-GDIP-T8
JESD-609 code	e0
Negative supply voltage upper limit	-18 V
Nominal Negative Supply Voltage (Vsup)	-15 V
Number of functions	1
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	+-15 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	5.08 mm
minimum slew rate	550 V/us
Nominal slew rate	1200 V/us
Maximum slew rate	20 mA
Supply voltage upper limit	18 V
Nominal supply voltage (Vsup)	15 V
surface mount	NO
technology	BIPOLAR
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

LM6121J/883 Related Products

	LM6121J/883	LM6121	LM6121H/883	LM6221H	LM6221N	LM6321	LM6321M
Description	BUFFER AMPLIFIER, PDSO14	BUFFER AMPLIFIER, PDSO14	BUFFER AMPLIFIER, PDSO14	BUFFER AMPLIFIER, PDSO14	BUFFER AMPLIFIER, PDSO14	BUFFER AMPLIFIER, PDSO14	BUFFER AMPLIFIER, PDSO14
Is it Rohs certified?	incompatible	-	incompatible	incompatible	incompatible	-	incompatible
Maker	National Semiconductor（TI ）	-	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	-	National Semiconductor（TI ）
Parts packaging code	DIP	-	BCY	BCY	DIP	-	SOIC
package instruction	DIP, DIP8,.3	-	, CAN8,.2	, CAN8,.2	DIP, DIP8,.3	-	SOP, SOP14,.25
Contacts	8	-	8	8	8	-	14
Reach Compliance Code	unknow	-	unknow	unknow	unknow	-	unknow
ECCN code	EAR99	-	EAR99	EAR99	EAR99	-	EAR99
Amplifier type	BUFFER	-	BUFFER	BUFFER	BUFFER	-	BUFFER
Maximum average bias current (IIB)	7 µA	-	7 µA	7 µA	7 µA	-	7 µA
Nominal bandwidth (3dB)	50 MHz	-	50 MHz	50 MHz	50 MHz	-	50 MHz
Maximum bias current (IIB) at 25C	4 µA	-	4 µA	7 µA	7 µA	-	5 µA
Maximum input offset voltage	50000 µV	-	50000 µV	60000 µV	60000 µV	-	100000 µV
JESD-30 code	R-GDIP-T8	-	O-MBCY-W8	O-MBCY-W8	R-PDIP-T8	-	R-PDSO-G14
JESD-609 code	e0	-	e0	e0	e0	-	e0
Negative supply voltage upper limit	-18 V	-	-18 V	-18 V	-18 V	-	-18 V
Nominal Negative Supply Voltage (Vsup)	-15 V	-	-15 V	-15 V	-15 V	-	-15 V
Number of functions	1	-	1	1	1	-	1
Number of terminals	8	-	8	8	8	-	14
Maximum operating temperature	125 °C	-	125 °C	85 °C	85 °C	-	70 °C
Minimum operating temperature	-55 °C	-	-55 °C	-40 °C	-40 °C	-	-
Package body material	CERAMIC, GLASS-SEALED	-	METAL	METAL	PLASTIC/EPOXY	-	PLASTIC/EPOXY
Encapsulate equivalent code	DIP8,.3	-	CAN8,.2	CAN8,.2	DIP8,.3	-	SOP14,.25
Package shape	RECTANGULAR	-	ROUND	ROUND	RECTANGULAR	-	RECTANGULAR
Package form	IN-LINE	-	CYLINDRICAL	CYLINDRICAL	IN-LINE	-	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
power supply	+-15 V	-	+-15 V	+-15 V	+-15 V	-	+-15 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
minimum slew rate	550 V/us	-	550 V/us	550 V/us	550 V/us	-	550 V/us
Nominal slew rate	1200 V/us	-	1200 V/us	1200 V/us	1200 V/us	-	1200 V/us
Maximum slew rate	20 mA	-	20 mA	20 mA	20 mA	-	22 mA
Supply voltage upper limit	18 V	-	18 V	18 V	18 V	-	18 V
Nominal supply voltage (Vsup)	15 V	-	15 V	15 V	15 V	-	15 V
surface mount	NO	-	NO	NO	NO	-	YES
technology	BIPOLAR	-	BIPOLAR	BIPOLAR	BIPOLAR	-	BIPOLAR
Temperature level	MILITARY	-	MILITARY	INDUSTRIAL	INDUSTRIAL	-	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	-	WIRE	WIRE	THROUGH-HOLE	-	GULL WING
Terminal location	DUAL	-	BOTTOM	BOTTOM	DUAL	-	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED

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