2SA608N datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> 2SA608N

2SA608N: DescriptionPNP transistor; CategoryDiscrete semiconductor; File Size113KB，1 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet View All

2SA608N Overview

PNP transistor

Features

Product Name: PNP Transistor

Product model: 2SA608N

Product parameters:

Pcm (maximum dissipated power): 500mW

Ic (collector current): 150mA

BVcbo (Collector-Base Breakdown Voltage): 60V

BVceo (Collector-Emitter Breakdown Voltage): 50V

BVebo (emitter-base breakdown voltage): 6V

hFE (current gain): Min: 160, Max: 560

VCE (sat) saturation voltage drop: 0.3V

fT (transition frequency): 200+MHz

Package: TO-92

Recommended Resources

Automatic LED billboard decorative light circuit at night

Hall element and motor starting principle b

Hypoxia monitor circuit diagram

SDCS16-4-10 polypropylene film processing machine circuit

Pronunciation logic tester

Test probe circuit

【AT-START-F425 Review】USB to CAN Preview Post: [Preface] Looking at the CAN analyzers on the market, most of them cost more than 100 yuan. I also bought a few CAN analyzers for the original automotive ECU project. I remember that the ones on Taoba...; lugl4313820 Domestic Chip Exchange

Abnormal sound from the front transformer of the power factor circuit: When using the power factor correction circuit, what is the reason for the abnormal noise of the transformer in the front stage? (The transformer is good. It uses a public frequency transformer, conne...; 朝朝暮暮朝朝 Electronics Design Contest

Packaging issues of double-row pluggable connectors: I want to find the 3D package file, i.e. .stp file, of a double-row pluggable connector like the one shown in the picture. This should be a product of Phoenix Contact However, on its official website,...; shaorc PCB Design

Japanese auto parts giant exposed to large-scale fraud for 20 years! Affecting 10 Japanese automakers...: Following the Denso fuel pump flameout scandal and Takata defective airbag recall scandal, Japanese auto parts manufacturers were once again exposed for product data fraud. According to media reports,...; eric_wang Automotive Electronics

【AT32WB415 Review】03 SPI Drive TFT LCD Screen: 03 SPI drive TFT LCD screen Preface The above has implemented the MCU's IO port, timer, external interrupt and other operations. On this basis, we will implement the driver of the TFT LCD screen for t...; 秦天qintian0303 RF/Wirelessly

[Environmental Experts on Smart Watches] Part 2: ON Semiconductor IDE Environment Construction: 1. Introduction Before setting up the environment, I read some other people's posts and learned that the Keil that I often use cannot download programs, and I am not familiar with IAR. I can only use ...; w494143467 onsemi and Avnet IoT Innovation Design Competition

Popular Components