DZ23C10

According to media reports on December 21, at today’s “2023 Science and Technology Ranking” annual ceremony, Zheng Weimin, academician of the Chinese Academy of Engineering and professor of Tsinghua ...[Details]

Image source: Physicists' Organization website A joint research team led by scientists from the School of Electrical Engineering at the Korea Advanced Institute of Science and Technolo...[Details]

On July 5, the source Moore's Law Is Dead revealed that AMD will release Zen 6 architecture chips in the second quarter of 2025, using TSMC's N3E process. Mass production will start before the end ...[Details]

According to news on November 22, at NVIDIA’s third quarter results meeting, NVIDIA’s chief financial officer said that it is currently studying solutions for export-restricted areas, and it is too e...[Details]

The launch ceremony of the French "Electronics 2030" plan was held at STMicroelectronics' Crolles plant • STMicroelectronics is one of the main leaders of the five-year strateg...[Details]

On March 23, a 6.6-magnitude earthquake occurred in the sea area of ​​Taitung County, Taiwan, China in the early hours of this morning. Since then, there have been continuous aftershocks of varying s...[Details]

According to Reuters on March 18, two people familiar with the matter revealed that TSMC is considering building advanced packaging production capacity in Japan, which would add impetus to Japan's re...[Details]

According to reports, Nvidia announced today its first quarter financial report for fiscal year 2022. The report shows that Nvidia's revenue in the first quarter was US$5.661 billion, an increase of ...[Details]

Yole Développement expects the advanced packaging market to grow at a CAGR of 6.6% from 2019 to 2025, with a total market value of approximately US$29 billion in 2018 In terms of revenue, mobile an...[Details]

Heterogeneous integration technology refers to the integration of separately manufactured components into a higher-level assembly or system-in-package (SiP) that, overall, provides enhanced functiona...[Details]

October 18, 2022, Suzhou, China – Today, Shanghai Yizhu Intelligent Technology Co., Ltd. signed a contract with the Shishan Business Innovation Zone of Suzhou High-tech Zone to officially locate its ...[Details]

Summary:   1. ASML dominates the semiconductor lithography market with 100% EUV share and 94.5% DUV Immersion share.   2. EUV customers represent the top 5 CapEx spenders of all semiconductor compan...[Details]

According to the latest survey by TrendForce's TrendForce Research Institute, the global packaging and testing industry showed signs of stabilizing in the third quarter of 2019, thanks to factors suc...[Details]

Avnet, a global electronic components distributor, recently announced that it has obtained Foreign Trade Zone authorization from the U.S. Customs and Border Protection (CBP) for its McKemy Distributi...[Details]

On November 15, ASML updated its long-term strategy and global market and technology trend analysis at the 2024 Investor Day meeting held recently, confirming that its annual revenue by 2030 will r...[Details]