Operational Amplifier, 1 Func, 14000uV Offset-Max, BIPolar, CDIP8,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Datalinear |
package instruction | DIP, DIP8,.3 |
Reach Compliance Code | unknow |
Amplifier type | OPERATIONAL AMPLIFIER |
Architecture | VOLTAGE-FEEDBACK |
frequency compensation | YES |
Maximum input offset voltage | 14000 µV |
JESD-30 code | R-XDIP-T8 |
JESD-609 code | e0 |
low-dissonance | NO |
Nominal Negative Supply Voltage (Vsup) | -15 V |
Number of functions | 1 |
Number of terminals | 8 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP8,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | +-15 V |
Certification status | Not Qualified |
Supply voltage upper limit | 20 V |
Nominal supply voltage (Vsup) | 15 V |
surface mount | NO |
technology | BIPOLAR |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
SP7-2512-2 | SP2-2515-5 | SP3-2515-5 | SP4-2510-2 | SP7-2510-2 | SP2-2512-2 | |
---|---|---|---|---|---|---|
Description | Operational Amplifier, 1 Func, 14000uV Offset-Max, BIPolar, CDIP8, | Operational Amplifier, 1 Func, 14000uV Offset-Max, BIPolar, MBCY8, | Operational Amplifier, 1 Func, 14000uV Offset-Max, BIPolar, PDIP8, | Operational Amplifier, 1 Func, 11000uV Offset-Max, BIPolar, CQCC20, | Operational Amplifier, 1 Func, 11000uV Offset-Max, BIPolar, CDIP8, | Operational Amplifier, 1 Func, 14000uV Offset-Max, BIPolar, MBCY8, |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Datalinear | Datalinear | Datalinear | Datalinear | Datalinear | Datalinear |
package instruction | DIP, DIP8,.3 | , CAN8,.23 | DIP, DIP8,.3 | QCCN, LCC20,.35SQ | DIP, DIP8,.3 | , CAN8,.23 |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknow |
Amplifier type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
frequency compensation | YES | YES | YES | YES | YES | YES |
Maximum input offset voltage | 14000 µV | 14000 µV | 14000 µV | 11000 µV | 11000 µV | 14000 µV |
JESD-30 code | R-XDIP-T8 | O-MBCY-W8 | R-PDIP-T8 | S-XQCC-N20 | R-XDIP-T8 | O-MBCY-W8 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
low-dissonance | NO | NO | NO | NO | NO | NO |
Nominal Negative Supply Voltage (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 8 | 8 | 8 | 20 | 8 | 8 |
Maximum operating temperature | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | - | - | -55 °C | -55 °C | -55 °C |
Package body material | CERAMIC | METAL | PLASTIC/EPOXY | CERAMIC | CERAMIC | METAL |
Encapsulate equivalent code | DIP8,.3 | CAN8,.23 | DIP8,.3 | LCC20,.35SQ | DIP8,.3 | CAN8,.23 |
Package shape | RECTANGULAR | ROUND | RECTANGULAR | SQUARE | RECTANGULAR | ROUND |
Package form | IN-LINE | CYLINDRICAL | IN-LINE | CHIP CARRIER | IN-LINE | CYLINDRICAL |
power supply | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Supply voltage upper limit | 20 V | 20 V | 20 V | 20 V | 20 V | 20 V |
Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | WIRE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | WIRE |
Terminal location | DUAL | BOTTOM | DUAL | QUAD | DUAL | BOTTOM |
encapsulated code | DIP | - | DIP | QCCN | DIP | - |
surface mount | NO | - | NO | YES | NO | - |
Terminal pitch | 2.54 mm | - | 2.54 mm | 1.27 mm | 2.54 mm | - |