SRAM Module, 2MX8, 120ns, CMOS, CQFP68, CERAMIC, QFP-68
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | White Electronic Designs Corporation |
package instruction | CERAMIC, QFP-68 |
Reach Compliance Code | unknow |
Maximum access time | 120 ns |
Other features | USER CONFIGURABLE AS 512K X 32 |
Spare memory width | 16 |
I/O type | COMMON |
JESD-30 code | S-CQFP-F68 |
JESD-609 code | e0 |
length | 39.6 mm |
memory density | 16777216 bi |
Memory IC Type | SRAM MODULE |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 68 |
word count | 2097152 words |
character code | 2000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 2MX8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | QFF |
Encapsulate equivalent code | QFL68,1.56SQ |
Package shape | SQUARE |
Package form | FLATPACK |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 3.56 mm |
Maximum standby current | 0.0016 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.2 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 39.6 mm |