Flash, 1GX1, 110ns, PDSO56, 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Cypress Semiconductor |
package instruction | HTSSOP, TSSOP56,.8,20 |
Reach Compliance Code | compli |
ECCN code | 3A991.B.1.A |
Maximum access time | 110 ns |
Spare memory width | 8 |
command user interface | YES |
Universal Flash Interface | YES |
Data polling | YES |
JESD-30 code | R-PDSO-G56 |
JESD-609 code | e3 |
length | 18.4 mm |
memory density | 1073741824 bi |
Memory IC Type | FLASH |
memory width | 1 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of departments/size | 1K |
Number of terminals | 56 |
word count | 1073741824 words |
character code | 1000000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 1GX1 |
Package body material | PLASTIC/EPOXY |
encapsulated code | HTSSOP |
Encapsulate equivalent code | TSSOP56,.8,20 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
page size | 8/16 words |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3/3.3 V |
Programming voltage | 3 V |
Certification status | Not Qualified |
ready/busy | YES |
Maximum seat height | 1.2 mm |
Department size | 128K |
Maximum standby current | 0.000005 A |
Maximum slew rate | 0.09 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |
switch bit | YES |
type | NOR TYPE |
width | 14 mm |