S26KL512SDABHV020 datasheet, PDF

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S26KL512SDABHV020: DescriptionNOR Flash Hyper 3V/3.3V 512M-bit 64M x 8 96ns 24-Pin Fortified BGA Tray; File Size1MB，102 Pages; ManufacturerCypress Semiconductor; Environmental Compliance

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S26KL512SDABHV020 Overview

NOR Flash Hyper 3V/3.3V 512M-bit 64M x 8 96ns 24-Pin Fortified BGA Tray

S26KL512SDABHV020 Parametric

Parameter Name	Attribute value
EU restricts the use of certain hazardous substances	Compliant
ECCN (US)	3A991b.1.a.
Part Status	Active
HTS	8542.32.00.71
Cell Type	NOR
Chip Density (bit)	512M
Architecture	Sectored
Boot Block	Yes
Block Organization	Symmetrical
Location of Boot Block	Bottom\|Top
Address Bus Width (bit)	18
Sector Size	64Kbyte x 1024
Number of Bits/Word (bit)	8
Number of Words	64M
Programmability	Yes
Timing Type	Synchronous
Max. Access Time (ns)	96
Maximum Erase Time (S)	462/Chip
Maximum Programming Time (ms)	1.26/Word
Process Technology	65nm
Interface Type	Hyper
Minimum Operating Supply Voltage (V)	2.7
Typical Operating Supply Voltage (V)	3\|3.3
Maximum Operating Supply Voltage (V)	3.6
Programming Voltage (V)	2.7 to 3.6
Operating Current (mA)	180
Program Current (mA)	100
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	105
Supplier Temperature Grade	Industrial Plus
Command Compatible	Yes
ECC Support	Yes
Support of Page Mode	Yes
Minimum Endurance (Cycles)	100000
Packaging	Tray
Supplier Package	Fortified BGA
Pin Count	24
Standard Package Name	BGA
Mounting	Surface Mount
Package Height	1(Max) - 0.2(Min)
Package Length	8
Package Width	6
PCB changed	24
Lead Shape	Ball

S26KL512SDABHV020 Related Products

	S26KL512SDABHV020	S26KL512SDABHV030	S26KL512SDABHV023
Description	NOR Flash Hyper 3V/3.3V 512M-bit 64M x 8 96ns 24-Pin Fortified BGA Tray	NOR Flash Hyper 3V/3.3V 512M-bit 64M x 8 96ns 24-Pin Fortified BGA Tray	NOR Flash Hyper 3V/3.3V 512M-bit 64M x 8 96ns 24-Pin Fortified BGA T/R
EU restricts the use of certain hazardous substances	Compliant	Compliant	Compliant
ECCN (US)	3A991b.1.a.	3A991.B.1.A	3A991.B.1.A
Part Status	Active	Active	Active
Cell Type	NOR	NOR	NOR
Chip Density (bit)	512M	512M	512M
Architecture	Sectored	Sectored	Sectored
Boot Block	Yes	Yes	Yes
Block Organization	Symmetrical	Symmetrical	Symmetrical
Location of Boot Block	Bottom\|Top	Bottom\|Top	Bottom\|Top
Address Bus Width (bit)	18	18	18
Sector Size	64Kbyte x 1024	64Kbyte x 1024	64Kbyte x 1024
Number of Bits/Word (bit)	8	8	8
Number of Words	64M	64M	64M
Programmability	Yes	Yes	Yes
Timing Type	Synchronous	Synchronous	Synchronous
Max. Access Time (ns)	96	96	96
Maximum Erase Time (S)	462/Chip	462/Chip	462/Chip
Maximum Programming Time (ms)	1.26/Word	1.26/Word	1.26/Word
Process Technology	65nm	65nm	65nm
Interface Type	Hyper	Hyper	Hyper
Minimum Operating Supply Voltage (V)	2.7	2.7	2.7
Typical Operating Supply Voltage (V)	3\|3.3	3\|3.3	3\|3.3
Maximum Operating Supply Voltage (V)	3.6	3.6	3.6
Programming Voltage (V)	2.7 to 3.6	2.7 to 3.6	2.7 to 3.6
Operating Current (mA)	180	180	180
Program Current (mA)	100	100	100
Minimum Operating Temperature (°C)	-40	-40	-40
Maximum Operating Temperature (°C)	105	105	105
Supplier Temperature Grade	Industrial Plus	Industrial Plus	Industrial Plus
Command Compatible	Yes	Yes	Yes
ECC Support	Yes	Yes	Yes
Support of Page Mode	Yes	Yes	Yes
Minimum Endurance (Cycles)	100000	100000	100000
Packaging	Tray	Tray	Tape and Reel
Supplier Package	Fortified BGA	Fortified BGA	Fortified BGA
Pin Count	24	24	24
Standard Package Name	BGA	BGA	BGA
Mounting	Surface Mount	Surface Mount	Surface Mount
Package Height	1(Max) - 0.2(Min)	1(Max) - 0.2(Min)	1(Max) - 0.2(Min)
Package Length	8	8	8
Package Width	6	6	6
PCB changed	24	24	24
Lead Shape	Ball	Ball	Ball
HTS	8542.32.00.71	8542.32.00.71	-

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