S29PL127J70BAI03 datasheet, PDF

S29PL127J70BAI03: DescriptionFlash, 8MX16, 70ns, PBGA80, 8 X 11 MM, FBGA-80; Categorystorage storage; File Size2MB，98 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S29PL127J70BAI03 Overview

Flash, 8MX16, 70ns, PBGA80, 8 X 11 MM, FBGA-80

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	VFBGA, BGA64,10X12,32
Contacts	80
Reach Compliance Code	compli
ECCN code	3A991.B.1.A
Maximum access time	70 ns
Other features	TOP AND BOTTOM BOOT BLOCK
startup block	BOTTOM/TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B80
JESD-609 code	e1
length	11 mm
memory density	134217728 bi
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	16,254
Number of terminals	80
word count	8388608 words
character code	8000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8MX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Encapsulate equivalent code	BGA64,10X12,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
page size	8 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1 mm
Department size	4K,32K
Maximum standby current	0.000005 A
Maximum slew rate	0.07 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
switch bit	YES
type	NOR TYPE
width	8 mm

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