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S29PL064J70BAI153

Description
Flash, 4MX16, 70ns, PBGA56, 7 X 9 MM, LEAD FREE COMPLIANT, FBGA-56
Categorystorage    storage   
File Size2MB,100 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
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S29PL064J70BAI153 Overview

Flash, 4MX16, 70ns, PBGA56, 7 X 9 MM, LEAD FREE COMPLIANT, FBGA-56

S29PL064J70BAI153 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSPANSION
Parts packaging codeBGA
package instruction7 X 9 MM, LEAD FREE COMPLIANT, FBGA-56
Contacts56
Reach Compliance Code_compli
ECCN code3A991.B.1.A
Maximum access time70 ns
Other featuresTOP AND BOTTOM BOOT BLOCK
startup blockBOTTOM/TOP
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PBGA-B56
JESD-609 codee0
length9 mm
memory density67108864 bi
Memory IC TypeFLASH
memory width16
Humidity sensitivity level3
Number of functions1
Number of departments/size16,126
Number of terminals56
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize4MX16
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA56,8X8,32
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
page size8 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply3/3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1 mm
Department size4K,32K
Maximum standby current0.000005 A
Maximum slew rate0.07 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
switch bitYES
typeNOR TYPE
width7 mm
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