S29PL064J60BFW152 datasheet, PDF

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S29PL064J60BFW152: DescriptionFlash, 4MX16, 60ns, PBGA56, 7 X 9 MM, LEAD FREE, FBGA-56; Categorystorage storage; File Size2MB，100 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S29PL064J60BFW152 Overview

Flash, 4MX16, 60ns, PBGA56, 7 X 9 MM, LEAD FREE, FBGA-56

S29PL064J60BFW152 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	7 X 9 MM, LEAD FREE, FBGA-56
Contacts	56
Reach Compliance Code	unknow
ECCN code	3A991.B.1.A
Maximum access time	60 ns
Other features	TOP AND BOTTOM BOOT BLOCK
startup block	BOTTOM/TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B56
JESD-609 code	e1
length	9 mm
memory density	67108864 bi
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	16,126
Number of terminals	56
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	4MX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Encapsulate equivalent code	BGA56,8X8,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
page size	8 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1 mm
Department size	4K,32K
Maximum standby current	0.000005 A
Maximum slew rate	0.07 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
switch bit	YES
type	NOR TYPE
width	7 mm

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