S29PL032J70BFW13 datasheet, PDF

S29PL032J70BFW13: DescriptionFlash, 2MX16, 70ns, PBGA56, 7 X 9 MM, FBGA-56; Categorystorage storage; File Size967KB，100 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S29PL032J70BFW13 Overview

Flash, 2MX16, 70ns, PBGA56, 7 X 9 MM, FBGA-56

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	7 X 9 MM, FBGA-56
Contacts	56
Reach Compliance Code	compli
ECCN code	3A991.B.1.A
Maximum access time	70 ns
startup block	BOTTOM/TOP
JESD-30 code	R-PBGA-B56
JESD-609 code	e1
length	8.95 mm
memory density	33554432 bi
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of terminals	56
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
type	NOR TYPE
width	7.95 mm

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