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S29GL512P11FAIV22

Description
Flash, 512MX1, 110ns, PBGA64, 13 X 11 MM, 1 MM PITCH, FBGA-64
Categorystorage    storage   
File Size3MB,80 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Download Datasheet Parametric View All

S29GL512P11FAIV22 Overview

Flash, 512MX1, 110ns, PBGA64, 13 X 11 MM, 1 MM PITCH, FBGA-64

S29GL512P11FAIV22 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSPANSION
Parts packaging codeBGA
package instructionLBGA, BGA64,8X8,40
Contacts64
Reach Compliance Code_compli
ECCN code3A991.B.1.A
Maximum access time110 ns
Spare memory width8
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PBGA-B64
JESD-609 codee0
length13 mm
memory density536870912 bi
Memory IC TypeFLASH
memory width1
Humidity sensitivity level3
Number of functions1
Number of departments/size512
Number of terminals64
word count536870912 words
character code512000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512MX1
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA64,8X8,40
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
page size8/16 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply1.8/3.3,3/3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.4 mm
Department size128K
Maximum standby current0.000005 A
Maximum slew rate0.11 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
switch bitYES
typeNOR TYPE
width11 mm
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