S29GL256M11FAIR12 datasheet, PDF

S29GL256M11FAIR12: DescriptionFlash, 16MX16, 110ns, PBGA64, 18 X 12 MM, FORTIFIED, BGA-64; Categorystorage storage; File Size6MB，116 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

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S29GL256M11FAIR12 Overview

Flash, 16MX16, 110ns, PBGA64, 18 X 12 MM, FORTIFIED, BGA-64

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SPANSION
Parts packaging code	BGA
package instruction	18 X 12 MM, FORTIFIED, BGA-64
Contacts	64
Reach Compliance Code	_compli
ECCN code	3A991.B.1.A
Maximum access time	110 ns
Spare memory width	8
startup block	BOTTOM/TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B64
JESD-609 code	e0
length	18 mm
memory density	268435456 bi
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	512
Number of terminals	64
word count	16777216 words
character code	16000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	16MX16
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA64,8X8,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
page size	4/8 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.4 mm
Department size	64K
Maximum standby current	0.000005 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
switch bit	YES
type	NOR TYPE
width	12 mm

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