Flash, 4MX16, 90ns, PBGA64, 13 X 11 MM, FBGA-64
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | SPANSION |
| Parts packaging code | BGA |
| package instruction | 13 X 11 MM, FBGA-64 |
| Contacts | 64 |
| Reach Compliance Code | compli |
| ECCN code | 3A991.B.1.A |
| Maximum access time | 90 ns |
| Spare memory width | 8 |
| JESD-30 code | R-PBGA-B64 |
| JESD-609 code | e0 |
| length | 13 mm |
| memory density | 67108864 bi |
| Memory IC Type | FLASH |
| memory width | 16 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 64 |
| word count | 4194304 words |
| character code | 4000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 4MX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LBGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, LOW PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 |
| Programming voltage | 3 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.4 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD |
| Terminal form | BALL |
| Terminal pitch | 1 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 30 |
| type | NOR TYPE |
| width | 11 mm |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD