S29GL01GS11FHI023 datasheet, PDF

S29GL01GS11FHI023: DescriptionEEPROM Card, 64MX16, 110ns, Parallel, CMOS, PBGA64, FBGA-64; Categorystorage storage; File Size3MB，99 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S29GL01GS11FHI023 Overview

EEPROM Card, 64MX16, 110ns, Parallel, CMOS, PBGA64, FBGA-64

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SPANSION
package instruction	LBGA, BGA64,8X8,40
Reach Compliance Code	compli
ECCN code	3A991.B.1.A
Maximum access time	110 ns
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B64
JESD-609 code	e1
length	13 mm
memory density	1073741824 bi
Memory IC Type	EEPROM CARD
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	1K
Number of terminals	64
word count	67108864 words
character code	64000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64MX16
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA64,8X8,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
page size	16 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Programming voltage	2.7 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.4 mm
Department size	64K
Maximum standby current	0.0001 A
Maximum slew rate	0.08 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
switch bit	YES
type	NOR TYPE
width	11 mm

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