S29GL01GS11DHIV23 datasheet, PDF

S29GL01GS11DHIV23: DescriptionFlash, 128MX8, 110ns, PBGA64, 9 X 9 MM, LEAD FREE, FBGA-64; Categorystorage storage; File Size901KB，106 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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Flash, 128MX8, 110ns, PBGA64, 9 X 9 MM, LEAD FREE, FBGA-64

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	LBGA, BGA64,8X8,40
Contacts	64
Reach Compliance Code	unknow
ECCN code	3A991.B.1.A
Maximum access time	110 ns
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	S-PBGA-B64
length	9 mm
memory density	1073741824 bi
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of departments/size	1K
Number of terminals	64
word count	134217728 words
character code	128000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128MX8
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA64,8X8,40
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE
page size	16 words
Parallel/Serial	PARALLEL
power supply	3/3.3 V
Programming voltage	2.7 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.4 mm
Department size	64K
Maximum standby current	0.0001 A
Maximum slew rate	0.08 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
switch bit	YES
type	NOR TYPE
width	9 mm

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