S29GL01GP12FAIV23 datasheet, PDF

S29GL01GP12FAIV23: DescriptionFlash, 1GX1, 120ns, PBGA64, 13 X 11 MM, 1 MM PITCH, FBGA-64; Categorystorage storage; File Size3MB，80 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

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S29GL01GP12FAIV23 Overview

Flash, 1GX1, 120ns, PBGA64, 13 X 11 MM, 1 MM PITCH, FBGA-64

Parameter Name	Attribute value
Maker	SPANSION
Parts packaging code	BGA
package instruction	LBGA,
Contacts	64
Reach Compliance Code	unknow
ECCN code	3A991.B.1.A
Maximum access time	120 ns
JESD-30 code	R-PBGA-B64
length	13 mm
memory density	1073741824 bi
Memory IC Type	FLASH
memory width	1
Number of functions	1
Number of terminals	64
word count	1073741824 words
character code	1000000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1GX1
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
type	NOR TYPE
width	11 mm

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