512KX18 LATE-WRITE SRAM, 1.5ns, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-119
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Motorola ( NXP ) |
| Parts packaging code | BGA |
| package instruction | BGA, |
| Contacts | 119 |
| Reach Compliance Code | unknow |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 1.5 ns |
| JESD-30 code | R-PBGA-B119 |
| JESD-609 code | e0 |
| length | 22 mm |
| memory density | 9437184 bi |
| Memory IC Type | LATE-WRITE SRAM |
| memory width | 18 |
| Number of functions | 1 |
| Number of terminals | 119 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512KX18 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 2.77 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.375 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | BALL |
| Terminal pitch | 1.27 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 14 mm |
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