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MT16DT464M-6

Description
Fast Page DRAM Module, 4MX64, 60ns, CMOS, DIMM-168
Categorystorage    storage   
File Size618KB,14 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Download Datasheet Parametric Compare View All

MT16DT464M-6 Overview

Fast Page DRAM Module, 4MX64, 60ns, CMOS, DIMM-168

MT16DT464M-6 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicron Technology
Parts packaging codeDIMM
package instructionDIMM-168
Contacts168
Reach Compliance Codeunknow
ECCN codeEAR99
access modeFAST PAGE
Maximum access time60 ns
Other featuresRAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
I/O typeCOMMON
JESD-30 codeR-XDMA-N168
memory density268435456 bi
Memory IC TypeFAST PAGE DRAM MODULE
memory width64
Humidity sensitivity level1
Number of functions1
Number of ports1
Number of terminals168
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX64
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM168
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)225
power supply5 V
Certification statusNot Qualified
refresh cycle2048
Maximum seat height25.4 mm
self refreshNO
Maximum standby current0.016 A
Maximum slew rate1.92 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED

MT16DT464M-6 Related Products

MT16DT464M-6 MT16D464M-6 MT16D464M-7
Description Fast Page DRAM Module, 4MX64, 60ns, CMOS, DIMM-168 Fast Page DRAM Module, 4MX64, 60ns, CMOS, DIMM-168 Fast Page DRAM Module, 4MX64, 70ns, CMOS, DIMM-168
Is it Rohs certified? incompatible incompatible incompatible
Maker Micron Technology Micron Technology Micron Technology
Parts packaging code DIMM DIMM DIMM
package instruction DIMM-168 DIMM-168 DIMM-168
Contacts 168 168 168
Reach Compliance Code unknow unknown unknown
ECCN code EAR99 EAR99 EAR99
access mode FAST PAGE FAST PAGE FAST PAGE
Maximum access time 60 ns 60 ns 70 ns
Other features RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
I/O type COMMON COMMON COMMON
JESD-30 code R-XDMA-N168 R-XDMA-N168 R-XDMA-N168
memory density 268435456 bi 268435456 bit 268435456 bit
Memory IC Type FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
memory width 64 64 64
Humidity sensitivity level 1 1 1
Number of functions 1 1 1
Number of ports 1 1 1
Number of terminals 168 168 168
word count 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C
organize 4MX64 4MX64 4MX64
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM DIMM
Encapsulate equivalent code DIMM168 DIMM168 DIMM168
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius) 225 225 225
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
refresh cycle 2048 2048 2048
Maximum seat height 25.4 mm 25.4 mm 25.4 mm
self refresh NO NO NO
Maximum standby current 0.016 A 0.016 A 0.016 A
Maximum slew rate 1.92 mA 1.92 mA 1.76 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount NO NO NO
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED

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