IC,FLIP-FLOP,SINGLE,J/K TYPE,STD-TTL,DIP,14PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Texas Instruments |
package instruction | DIP, DIP14,.3 |
Reach Compliance Code | not_compliant |
JESD-30 code | R-XDIP-T14 |
Logic integrated circuit type | J-K FLIP-FLOP |
Number of functions | 1 |
Number of terminals | 14 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP14,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
surface mount | NO |
technology | TTL |
Temperature level | MILITARY |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Trigger type | POSITIVE EDGE |
5962-01-124-9434 | 5962-00-247-3399 | |
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Description | IC,FLIP-FLOP,SINGLE,J/K TYPE,STD-TTL,DIP,14PIN,CERAMIC | IC,FLIP-FLOP,SINGLE,J/K TYPE,STD-TTL,DIP,14PIN,CERAMIC |
Is it Rohs certified? | incompatible | incompatible |
Maker | Texas Instruments | Texas Instruments |
package instruction | DIP, DIP14,.3 | DIP, DIP14,.3 |
Reach Compliance Code | not_compliant | not_compliant |
JESD-30 code | R-XDIP-T14 | R-XDIP-T14 |
Logic integrated circuit type | J-K FLIP-FLOP | J-K FLIP-FLOP |
Number of functions | 1 | 1 |
Number of terminals | 14 | 14 |
Maximum operating temperature | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C |
Package body material | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP |
Encapsulate equivalent code | DIP14,.3 | DIP14,.3 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE |
Certification status | Not Qualified | Not Qualified |
surface mount | NO | NO |
technology | TTL | TTL |
Temperature level | MILITARY | MILITARY |
Terminal form | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL |
Trigger type | POSITIVE EDGE | POSITIVE EDGE |