UVPROM, 64KX16, 150ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-40
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Mitsubishi |
Parts packaging code | DIP |
package instruction | WDIP, DIP40,.6 |
Contacts | 40 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 150 ns |
Other features | PAGE WRITE |
I/O type | COMMON |
JESD-30 code | R-GDIP-T40 |
JESD-609 code | e0 |
length | 52.07 mm |
memory density | 1048576 bit |
Memory IC Type | UVPROM |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 40 |
word count | 65536 words |
character code | 64000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 64KX16 |
Output characteristics | 3-STATE |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | WDIP |
Encapsulate equivalent code | DIP40,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE, WINDOW |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 5.1 mm |
Maximum standby current | 0.0001 A |
Maximum slew rate | 0.05 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
M5M27C102K-15 | M5M27C102K-12 | |
---|---|---|
Description | UVPROM, 64KX16, 150ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-40 | UVPROM, 64KX16, 120ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-40 |
Is it lead-free? | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible |
Maker | Mitsubishi | Mitsubishi |
Parts packaging code | DIP | DIP |
package instruction | WDIP, DIP40,.6 | WDIP, DIP40,.6 |
Contacts | 40 | 40 |
Reach Compliance Code | unknown | unknown |
ECCN code | EAR99 | EAR99 |
Maximum access time | 150 ns | 120 ns |
Other features | PAGE WRITE | PAGE WRITE |
I/O type | COMMON | COMMON |
JESD-30 code | R-GDIP-T40 | R-GDIP-T40 |
JESD-609 code | e0 | e0 |
length | 52.07 mm | 52.07 mm |
memory density | 1048576 bit | 1048576 bit |
Memory IC Type | UVPROM | UVPROM |
memory width | 16 | 16 |
Number of functions | 1 | 1 |
Number of terminals | 40 | 40 |
word count | 65536 words | 65536 words |
character code | 64000 | 64000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C |
organize | 64KX16 | 64KX16 |
Output characteristics | 3-STATE | 3-STATE |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
encapsulated code | WDIP | WDIP |
Encapsulate equivalent code | DIP40,.6 | DIP40,.6 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE, WINDOW | IN-LINE, WINDOW |
Parallel/Serial | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified |
Maximum seat height | 5.1 mm | 5.1 mm |
Maximum standby current | 0.0001 A | 0.0001 A |
Maximum slew rate | 0.05 mA | 0.05 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V |
surface mount | NO | NO |
technology | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
width | 15.24 mm | 15.24 mm |