OTP ROM, 8KX8, 45ns, TTL, CDIP24,
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Fairchild |
package instruction | DIP, DIP24,.6 |
Reach Compliance Code | compliant |
Maximum access time | 45 ns |
JESD-30 code | R-XDIP-T24 |
JESD-609 code | e0 |
memory density | 65536 bit |
Memory IC Type | OTP ROM |
memory width | 8 |
Humidity sensitivity level | 2A |
Number of terminals | 24 |
word count | 8192 words |
character code | 8000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8KX8 |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | 250 |
Certification status | Not Qualified |
Filter level | MIL-STD-883 Class C |
surface mount | NO |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |