Decoder/Driver, CMOS, CDIP16
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Dynex |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
Logic integrated circuit type | OTHER DECODER/DRIVER |
MaximumI(ol) | 0.024 A |
Number of functions | 1 |
Number of terminals | 16 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Certification status | Not Qualified |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
MV74SC138DG | MV74SC137DG | |
---|---|---|
Description | Decoder/Driver, CMOS, CDIP16 | Decoder/Driver, CMOS, CDIP16 |
Is it Rohs certified? | incompatible | incompatible |
Maker | Dynex | Dynex |
package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown |
JESD-30 code | R-XDIP-T16 | R-XDIP-T16 |
JESD-609 code | e0 | e0 |
Logic integrated circuit type | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
MaximumI(ol) | 0.024 A | 0.024 A |
Number of functions | 1 | 1 |
Number of terminals | 16 | 16 |
Maximum operating temperature | 70 °C | 70 °C |
Package body material | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE |
Certification status | Not Qualified | Not Qualified |
surface mount | NO | NO |
technology | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL |