IC,DRAM,EDO,4MX4,CMOS,TSOP,24PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | NXP |
package instruction | TSOP, TSOP24/26,.36 |
Reach Compliance Code | unknown |
Maximum access time | 50 ns |
I/O type | COMMON |
JESD-30 code | R-PDSO-G24 |
JESD-609 code | e0 |
memory density | 16777216 bit |
Memory IC Type | EDO DRAM |
memory width | 4 |
Number of terminals | 24 |
word count | 4194304 words |
character code | 4000000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4MX4 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSOP |
Encapsulate equivalent code | TSOP24/26,.36 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE |
power supply | 3.3 V |
Certification status | Not Qualified |
refresh cycle | 2048 |
self refresh | NO |
Maximum standby current | 0.0005 A |
Maximum slew rate | 0.13 mA |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
MCM517405DVT50 | MCM517405DVJ50 | |
---|---|---|
Description | IC,DRAM,EDO,4MX4,CMOS,TSOP,24PIN,PLASTIC | IC,DRAM,EDO,4MX4,CMOS,SOJ,24PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible |
Maker | NXP | NXP |
package instruction | TSOP, TSOP24/26,.36 | SOJ, SOJ24/26,.34 |
Reach Compliance Code | unknown | unknown |
Maximum access time | 50 ns | 50 ns |
I/O type | COMMON | COMMON |
JESD-30 code | R-PDSO-G24 | R-PDSO-J24 |
JESD-609 code | e0 | e0 |
memory density | 16777216 bit | 16777216 bit |
Memory IC Type | EDO DRAM | EDO DRAM |
memory width | 4 | 4 |
Number of terminals | 24 | 24 |
word count | 4194304 words | 4194304 words |
character code | 4000000 | 4000000 |
Maximum operating temperature | 70 °C | 70 °C |
organize | 4MX4 | 4MX4 |
Output characteristics | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | TSOP | SOJ |
Encapsulate equivalent code | TSOP24/26,.36 | SOJ24/26,.34 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
power supply | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified |
refresh cycle | 2048 | 2048 |
self refresh | NO | NO |
Maximum standby current | 0.0005 A | 0.0005 A |
Maximum slew rate | 0.13 mA | 0.13 mA |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V |
surface mount | YES | YES |
technology | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | J BEND |
Terminal pitch | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL |