RF System on a Chip - SoC Sub-1GHz Sys-on-Chip w/MCU 16kB Fl Mem
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Texas Instruments |
| Parts packaging code | QFN |
| package instruction | HVQCCN, LCC36,.25SQ,20 |
| Contacts | 36 |
| Reach Compliance Code | compli |
| Factory Lead Time | 1 week |
| JESD-30 code | S-XQCC-N36 |
| JESD-609 code | e4 |
| length | 6 mm |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 36 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | UNSPECIFIED |
| encapsulated code | HVQCCN |
| Encapsulate equivalent code | LCC36,.25SQ,20 |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3 V |
| Certification status | Not Qualified |
| Maximum seat height | 0.9 mm |
| Nominal supply voltage | 3 V |
| surface mount | YES |
| technology | CMOS |
| Telecom integrated circuit types | RF AND BASEBAND CIRCUIT |
| Temperature level | INDUSTRIAL |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 6 mm |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD
