SN74S412NP1 datasheet, PDF - EEWORLD Datasheet

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SN74S412NP1: DescriptionIC,I/O PORT,8-BIT,BIPOLAR,DIP,24PIN,PLASTIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size260KB，5 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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SN74S412NP1 Overview

IC,I/O PORT,8-BIT,BIPOLAR,DIP,24PIN,PLASTIC

SN74S412NP1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP24,.6
Reach Compliance Code	not_compliant
JESD-30 code	R-PDIP-T24
Number of digits	8
Number of terminals	24
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

SN74S412NP1 Related Products

	SN74S412NP1	SN74S412JP4	SN74S412J4	SN74S412FN3	SN74S412NP3	SN74S412N1	SN74S412D	SN74S412D3	SNC54S412J
Description	IC,I/O PORT,8-BIT,BIPOLAR,DIP,24PIN,PLASTIC	IC IC,I/O PORT,8-BIT,BIPOLAR,DIP,24PIN,CERAMIC, Parallel IO Port	IC IC,I/O PORT,8-BIT,BIPOLAR,DIP,24PIN,CERAMIC, Parallel IO Port	IC IC,I/O PORT,8-BIT,BIPOLAR,LDCC,28PIN,PLASTIC, Parallel IO Port	IC IC,I/O PORT,8-BIT,BIPOLAR,DIP,24PIN,PLASTIC, Parallel IO Port	IC IC,I/O PORT,8-BIT,BIPOLAR,DIP,24PIN,PLASTIC, Parallel IO Port	IC,I/O PORT,8-BIT,BIPOLAR,SOP,24PIN,PLASTIC	IC IC,I/O PORT,8-BIT,BIPOLAR,SOP,24PIN,PLASTIC, Parallel IO Port	IC,I/O PORT,8-BIT,BIPOLAR,DIP,24PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	QCCJ, LDCC28,.5SQ	DIP, DIP24,.6	DIP, DIP24,.6	SOP, SOP24,.4	SOP, SOP24,.4	DIP, DIP24,.6
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
JESD-30 code	R-PDIP-T24	R-XDIP-T24	R-XDIP-T24	S-PQCC-J28	R-PDIP-T24	R-PDIP-T24	R-PDSO-G24	R-PDSO-G24	R-XDIP-T24
Number of digits	8	8	8	8	8	8	8	8	8
Number of terminals	24	24	24	28	24	24	24	24	24
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	125 °C
Package body material	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	DIP	DIP	QCCJ	DIP	DIP	SOP	SOP	DIP
Encapsulate equivalent code	DIP24,.6	DIP24,.6	DIP24,.6	LDCC28,.5SQ	DIP24,.6	DIP24,.6	SOP24,.4	SOP24,.4	DIP24,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
surface mount	NO	NO	NO	YES	NO	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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