EDO DRAM, 16MX4, 60ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP2-32
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | SAMSUNG |
Parts packaging code | TSOP2 |
package instruction | TSOP2, |
Contacts | 32 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
access mode | FAST PAGE WITH EDO |
Maximum access time | 60 ns |
Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
JESD-30 code | R-PDSO-G32 |
length | 20.95 mm |
memory density | 67108864 bit |
Memory IC Type | EDO DRAM |
memory width | 4 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 32 |
word count | 16777216 words |
character code | 16000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 16MX4 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSOP2 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE |
Peak Reflow Temperature (Celsius) | 240 |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
self refresh | YES |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
width | 10.16 mm |