|
UPD70F3040GM-UEU |
UPD70F3040GM-UEU-A |
UPD70F3040YGM-UEU |
Description |
Microcontroller, 32-Bit, FLASH, 20MHz, MOS, PQFP176, 24 X 24 MM, PLASTIC, LQFP-176 |
Microcontroller, 32-Bit, FLASH, 20MHz, MOS, PQFP176, 24 X 24 MM, PLASTIC, LQFP-176 |
Microcontroller, 32-Bit, FLASH, 20MHz, MOS, PQFP176, 24 X 24 MM, PLASTIC, LQFP-176 |
Is it Rohs certified? |
incompatible |
conform to |
incompatible |
Maker |
NEC Electronics |
NEC Electronics |
NEC Electronics |
package instruction |
24 X 24 MM, PLASTIC, LQFP-176 |
24 X 24 MM, PLASTIC, LQFP-176 |
24 X 24 MM, PLASTIC, LQFP-176 |
Reach Compliance Code |
compliant |
compliant |
compliant |
Has ADC |
YES |
YES |
YES |
Address bus width |
22 |
22 |
22 |
bit size |
32 |
32 |
32 |
maximum clock frequency |
20 MHz |
20 MHz |
20 MHz |
DAC channel |
NO |
NO |
NO |
DMA channel |
YES |
YES |
YES |
External data bus width |
16 |
16 |
16 |
JESD-30 code |
S-PQFP-G176 |
S-PQFP-G176 |
S-PQFP-G176 |
JESD-609 code |
e0 |
e6/e4 |
e0 |
length |
24 mm |
24 mm |
24 mm |
Number of I/O lines |
151 |
151 |
151 |
Number of terminals |
176 |
176 |
176 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
PWM channel |
YES |
YES |
YES |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
LFQFP |
LFQFP |
LFQFP |
Package shape |
SQUARE |
SQUARE |
SQUARE |
Package form |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
260 |
NOT SPECIFIED |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
ROM programmability |
FLASH |
FLASH |
FLASH |
Maximum seat height |
1.6 mm |
1.6 mm |
1.6 mm |
speed |
20 MHz |
20 MHz |
20 MHz |
Maximum supply voltage |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage |
3.1 V |
3.1 V |
3.1 V |
Nominal supply voltage |
3.3 V |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
YES |
technology |
MOS |
MOS |
MOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
TIN LEAD |
TIN BISMUTH/NICKEL PALLADIUM GOLD |
TIN LEAD |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
Terminal location |
QUAD |
QUAD |
QUAD |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
10 |
NOT SPECIFIED |
width |
24 mm |
24 mm |
24 mm |
uPs/uCs/peripheral integrated circuit type |
MICROCONTROLLER |
MICROCONTROLLER |
MICROCONTROLLER |