D/A Converter, 16-Bit, 1 Func, Bipolar, CQCC28,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Burr-Brown |
Reach Compliance Code | unknown |
Converter type | D/A CONVERTER |
Enter bit code | COMPLEMENTARY OFFSET BINARY |
JESD-30 code | S-XQCC-N28 |
JESD-609 code | e0 |
Maximum linear error (EL) | 0.003% |
Number of digits | 16 |
Number of functions | 1 |
Number of terminals | 28 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -25 °C |
Package body material | CERAMIC |
encapsulated code | QCCN |
Encapsulate equivalent code | LCC28,.45SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
power supply | 5,+-15 V |
Certification status | Not Qualified |
Maximum stabilization time | 3 µs |
Maximum slew rate | 58 mA |
surface mount | YES |
technology | BIPOLAR |
Temperature level | OTHER |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
DAC702BL | DAC703SH-BSS2 | DAC702SL | DAC702SL/QM | DAC702BL/QM | DAC701SL | DAC701SL/QM | DAC702LL | DAC703SL-BSS2 | |
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Description | D/A Converter, 16-Bit, 1 Func, Bipolar, CQCC28, | D/A Converter, 16-Bit, 1 Func, Hybrid, CDIP24, | D/A Converter, 16-Bit, 1 Func, Bipolar, CQCC28, | D/A Converter, 16-Bit, 1 Func, Bipolar, CQCC28, | D/A Converter, 16-Bit, 1 Func, Bipolar, CQCC28, | D/A Converter, 16-Bit, 1 Func, Bipolar, CQCC28, | D/A Converter, 16-Bit, 1 Func, Bipolar, CQCC28, | D/A Converter, 16-Bit, 1 Func, Bipolar, CQCC28, | D/A Converter, 16-Bit, 1 Func, Hybrid, CQCC28, |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Converter type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
Enter bit code | COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY | COMPLEMENTARY BINARY | COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY OFFSET BINARY |
JESD-30 code | S-XQCC-N28 | R-XDIP-T24 | S-XQCC-N28 | S-XQCC-N28 | S-XQCC-N28 | S-XQCC-N28 | S-XQCC-N28 | S-XQCC-N28 | S-XQCC-N28 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
Maximum linear error (EL) | 0.003% | 0.003% | 0.003% | 0.003% | 0.003% | 0.003% | 0.003% | 0.0015% | 0.003% |
Number of digits | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 24 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
Maximum operating temperature | 85 °C | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 70 °C | 125 °C |
Minimum operating temperature | -25 °C | -55 °C | -55 °C | -55 °C | -25 °C | -55 °C | -55 °C | - | -55 °C |
Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | QCCN | DIP | QCCN | QCCN | QCCN | QCCN | QCCN | QCCN | QCCN |
Encapsulate equivalent code | LCC28,.45SQ | DIP24,.6 | LCC28,.45SQ | LCC28,.45SQ | LCC28,.45SQ | LCC28,.45SQ | LCC28,.45SQ | LCC28,.45SQ | LCC28,.45SQ |
Package shape | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
power supply | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum stabilization time | 3 µs | 8 µs | 3 µs | 3 µs | 3 µs | 8 µs | 8 µs | 3 µs | 8 µs |
Maximum slew rate | 58 mA | 68 mA | 58 mA | 58 mA | 58 mA | 68 mA | 68 mA | 58 mA | 68 mA |
surface mount | YES | NO | YES | YES | YES | YES | YES | YES | YES |
technology | BIPOLAR | HYBRID | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | HYBRID |
Temperature level | OTHER | MILITARY | MILITARY | MILITARY | OTHER | MILITARY | MILITARY | COMMERCIAL | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | QUAD | DUAL | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
Maker | Burr-Brown | Burr-Brown | - | - | - | Burr-Brown | Burr-Brown | Burr-Brown | Burr-Brown |
Filter level | - | BS9000 Level S2 | - | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | - | MIL-STD-883 Class B (Modified) | - | BS9000 Level S2 |