EEPROM, 2KX8, 350ns, Parallel, CMOS, CDIP24
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Reach Compliance Code | not_compliant |
Maximum access time | 350 ns |
command user interface | NO |
Data polling | YES |
Durability | 10000 Write/Erase Cycles |
JESD-30 code | R-XDIP-T24 |
JESD-609 code | e0 |
memory density | 16384 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Number of terminals | 24 |
word count | 2048 words |
character code | 2000 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 2KX8 |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Maximum standby current | 0.0009 A |
Maximum slew rate | 0.125 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 6 |
switch bit | NO |
Maximum write cycle time (tWC) | 10 ms |